EP 1702 white epoxy potting adhesive, easily meets the waterproof and insulation challenges of electronic components!

In modern electronic manufacturing, more and more terminal equipment put forward higher requirements of “multi performance integration” for potting adhesive: not only must it be waterproof and moisture-proof, reliable insulation, strong anti-aging ability, but also must achieve low shrinkage, bright surface, and bubble free packaging effect. Today, we will share a real case of ELAPLUS star product – EP 1702 white epoxy potting adhesive in customer applications, taking you to understand how it easily meets the challenges of electronic component potting!

Project background: The customer’s pain points are highlighted, and traditional adhesives are difficult to handle
A customer specializing in industrial electronic module packaging has been searching for a sealing adhesive that combines easy operation, excellent insulation, and moisture resistance stability for their small relays, power modules, controllers, and other products. Although the adhesive used previously had decent apparent performance, there were several issues:
Slow curing at room temperature, affecting the production line rhythm;
During the sealing process, there are many bubbles that are difficult to eliminate;
After curing, the surface is not smooth enough and the appearance is not good;
It is prone to aging and shedding in humid and hot environments.
So, the customer decided to introduce ELAPLUS recommended EP 1702 two-component ambient temperature epoxy potting adhesive and conduct a one week potting and environmental testing.

Solution: EP 1702 white epoxy sealant
EP 1702 is a white two-component ambient temperature curing epoxy potting adhesive designed specifically for electronic devices, with the following core advantages:
Low exothermic reaction, with a shrinkage rate of less than 2% during the curing process
Strong operability, the operable time after mixing can reach 40 minutes to 2 hours
After curing, the surface is shiny and does not bubble
Wide temperature resistance range (-40~120 ℃), stable electrical performance
The customer selected the standard EP 1702 white potting adhesive for testing according to their requirements, with an operating ratio of A: B=5:1. After curing at room temperature, assembly can be carried out, and heating at 80 ℃ for 2 hours can accelerate the curing process.
Implementation process: Process standardization+product stability, achieving packaging efficiency
Key points of operation process:
Pre treatment: The white colloid of component A needs to be stirred evenly before use to eliminate precipitation;
Glue mixing and stirring: Weigh AB components in proportion and stir thoroughly, while performing vacuum defoaming operation;
Sealing operation: After sealing, let it stand and cure. If it is winter or a damp cold environment, it can be heated and cured;
Curing test: After curing at 80 ℃ for 2 hours, it can be basically hardened, with a bright surface and no bubbles.
Sealing object:
Small control circuit module
Switching power module
Multi pin relay device base
Performance after curing:
Hardness of 70-85 Shore-D, high strength
Breakdown voltage ≥ 18kV/mm, ensuring insulation safety
Shear strength ≥ 7MPa, long-term stability without detachment
Dielectric loss tangent<0.01, minimal signal interference
Application achievement: Speak with data
All samples showed no blistering, cracking, or delamination for 72 consecutive hours under wet heat aging test (85 ℃, 85% RH);
IP level testing achieves protection of IP67 or above;
The customer reported a 30% increase in average sealing efficiency and a 50% decrease in repair rate;
Visually, the white encapsulation layer makes the finished product simpler and more aesthetically pleasing, which is more in line with the positioning of high-end electrical products.
Summary: EP 1702, Transforming “General” into “Professional”
This case fully demonstrates that EP 1702 white epoxy sealant not only performs well in general electronic components, but also has high performance, high operability, and good stability, making it very suitable for mass production applications. If you are also struggling with issues such as electronic module packaging, encapsulation efficiency, and appearance quality, why not try this encapsulation solution that combines professional performance and economic efficiency!
📌 If you need more technical parameters, sample testing, or solution support, please feel free to contact the ELAPLUS Yilian technical team.
Official website: www.elaplus.comc
Hotline: 021-67227200
Tags: two-component epoxy resin adhesive · room temperature curing potting adhesive · epoxy potting adhesive · electronic component potting adhesive · power module potting adhesive · white potting adhesive · circuit board potting adhesive · moisture-proof and waterproof potting material