Excellent heat dissipation and protection performance
After sealing with PUR 1680, the product successfully passed the high-temperature and high humidity test. The circuit board remained stable during long-term operation, and its thermal conductivity met the requirements of light to moderate heat dissipation, avoiding component overheating damage.
Yilian has always been committed to providing high-quality and affordable adhesive solutions for the electronic manufacturing industry. We believe that this dam sealing solution can bring convenience and value to more electronic manufacturing enterprises, and we will continue to research and develop more products that meet market demand.
If you are interested in our SIPC 1859 and PUR 1680, please feel free to contact us at any time for more technical support and product information. Let Yilian adhesive provide more reliable protection for your products!
Tags: Dam enclosure glue · Dam enclosure glue · Circuit board enclosure glue · Circuit board sealing
The sealing adhesive has a certain thermal conductivity coefficient: it ensures that the heat of the circuit board can be conducted in a timely manner, reducing the impact of high temperature on the components;
Non brushed fence rubber: improves construction efficiency and avoids affecting product appearance or packaging quality due to brushed rubber materials;
Affordable price: Control material costs, suitable for mass production.
The following is our recommended combination of dam and sealant – dam sealant SIPC 1859 silicone adhesive and sealant PUR 1680 polyurethane sealant, which perform well in terms of performance and cost-effectiveness.
Beginor Circuit Board Dam Sealing Solution
1、 Dam sealant: SIPC 1859
SIPC 1859 is a high-performance single component silicone sealant that is highly suitable for use as dam sealant. Its advantages include:
No wire drawing, excellent molding effect
In the process of dam enclosure, wire drawing of adhesive materials can lead to defects in the packaging process, such as uneven colloid and leakage of sealing. SIPC 1859 has excellent rheological properties, and the gel can be quickly formed after dispensing without any wire drawing, ensuring the accuracy of dam enclosure.
Strong adhesion, suitable for various substrates
SIPC 1859 can adhere well to various common materials such as PCB boards, metals, plastics, etc., forming a stable and reliable dam structure, effectively preventing leakage of sealant.
High cost-effectiveness, suitable for large-scale production
The affordable price and stable quality can significantly reduce production costs, making it particularly suitable for electronic product manufacturing enterprises that require mass production.
2、 Sealing adhesive: PUR 1680 polyurethane sealing adhesive
After the formation of the dam, sealing is the core step of circuit board protection. The PUR 1680 we recommend is a comprehensive polyurethane potting adhesive that can meet the needs of potting well. Its features include:
A certain thermal conductivity coefficient
PUR 1680 has certain thermal conductivity and can quickly dissipate the heat generated by the circuit board during operation, preventing damage to sensitive components caused by local overheating. At the same time, its thermal conductivity can meet the heat dissipation needs of most low to medium power circuit boards.
Good liquidity, filling without dead corners
PUR 1680 has good fluidity and can quickly penetrate into every corner of the circuit board, achieving comprehensive filling and effectively protecting components from external environmental influences such as moisture, dust, or mechanical impact.
Superior performance after curing
The cured PUR 1680 has good toughness and hardness, which can effectively prevent cracking caused by environmental changes (such as temperature fluctuations), while providing excellent electrical insulation performance to protect the normal operation of the circuit board.
Cost control advantage
Compared with other high-performance potting adhesives, PUR 1680 is a very affordable choice as it ensures performance at a more competitive price.
3、 Application advantages of the solution
Reliability improvement
Through the dual protection of SIPC 1859 dam sealant and PUR 1680 sealant, the circuit board can be protected from external environmental damage, significantly improving the overall reliability and service life of the product.
Convenient operation and improved efficiency
SIPC 1859 dam sealant construction is smooth and non brushed, ensuring rapid molding of the dam, while PUR 1680 has excellent fluidity and reasonable curing time, which helps to improve overall production efficiency.
High cost-effectiveness, suitable for mass production
This combination scheme has cost control advantages while ensuring high quality, especially suitable for enterprises pursuing efficiency in mass production.
Wide applicability
This solution is not only suitable for conventional circuit boards, but can also meet various special application scenarios that require dam sealing, such as electronic component protection in high humidity environments, module packaging with light to moderate heat dissipation requirements, etc
4、 Practical application cases
Efficient dam enclosure effect
In a mass-produced circuit board project, the use of SIPC 1859 dam sealant resulted in uniform dam forming and a 30% increase in operational efficiency, without any issues of adhesive material drawing or leakage sealing.
Non brushed fence rubber: improves construction efficiency and avoids affecting product appearance or packaging quality due to brushed rubber materials;
Affordable price: Control material costs, suitable for mass production.
The following is our recommended combination of dam and sealant – dam sealant SIPC 1859 silicone adhesive and sealant PUR 1680 polyurethane sealant, which perform well in terms of performance and cost-effectiveness.
Beginor Circuit Board Dam Sealing Solution
1、 Dam sealant: SIPC 1859
SIPC 1859 is a high-performance single component silicone sealant that is highly suitable for use as dam sealant. Its advantages include:
No wire drawing, excellent molding effect
In the process of dam enclosure, wire drawing of adhesive materials can lead to defects in the packaging process, such as uneven colloid and leakage of sealing. SIPC 1859 has excellent rheological properties, and the gel can be quickly formed after dispensing without any wire drawing, ensuring the accuracy of dam enclosure.
Strong adhesion, suitable for various substrates
SIPC 1859 can adhere well to various common materials such as PCB boards, metals, plastics, etc., forming a stable and reliable dam structure, effectively preventing leakage of sealant.
High cost-effectiveness, suitable for large-scale production
The affordable price and stable quality can significantly reduce production costs, making it particularly suitable for electronic product manufacturing enterprises that require mass production.
2、 Sealing adhesive: PUR 1680 polyurethane sealing adhesive
After the formation of the dam, sealing is the core step of circuit board protection. The PUR 1680 we recommend is a comprehensive polyurethane potting adhesive that can meet the needs of potting well. Its features include:
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A certain thermal conductivity coefficient
PUR 1680 has certain thermal conductivity and can quickly dissipate the heat generated by the circuit board during operation, preventing damage to sensitive components caused by local overheating. At the same time, its thermal conductivity can meet the heat dissipation needs of most low to medium power circuit boards.
Good liquidity, filling without dead corners
PUR 1680 has good fluidity and can quickly penetrate into every corner of the circuit board, achieving comprehensive filling and effectively protecting components from external environmental influences such as moisture, dust, or mechanical impact.
Superior performance after curing
The cured PUR 1680 has good toughness and hardness, which can effectively prevent cracking caused by environmental changes (such as temperature fluctuations), while providing excellent electrical insulation performance to protect the normal operation of the circuit board.
Cost control advantage
Compared with other high-performance potting adhesives, PUR 1680 is a very affordable choice as it ensures performance at a more competitive price.
3、 Application advantages of the solution
Reliability improvement
Through the dual protection of SIPC 1859 dam sealant and PUR 1680 sealant, the circuit board can be protected from external environmental damage, significantly improving the overall reliability and service life of the product.
Convenient operation and improved efficiency
SIPC 1859 dam sealant construction is smooth and non brushed, ensuring rapid molding of the dam, while PUR 1680 has excellent fluidity and reasonable curing time, which helps to improve overall production efficiency.
High cost-effectiveness, suitable for mass production
This combination scheme has cost control advantages while ensuring high quality, especially suitable for enterprises pursuing efficiency in mass production.
Wide applicability
This solution is not only suitable for conventional circuit boards, but can also meet various special application scenarios that require dam sealing, such as electronic component protection in high humidity environments, module packaging with light to moderate heat dissipation requirements, etc
4、 Practical application cases
Efficient dam enclosure effect
In a mass-produced circuit board project, the use of SIPC 1859 dam sealant resulted in uniform dam forming and a 30% increase in operational efficiency, without any issues of adhesive material drawing or leakage sealing. Excellent heat dissipation and protection performance
After sealing with PUR 1680, the product successfully passed the high-temperature and high humidity test. The circuit board remained stable during long-term operation, and its thermal conductivity met the requirements of light to moderate heat dissipation, avoiding component overheating damage.
Yilian has always been committed to providing high-quality and affordable adhesive solutions for the electronic manufacturing industry. We believe that this dam sealing solution can bring convenience and value to more electronic manufacturing enterprises, and we will continue to research and develop more products that meet market demand.
If you are interested in our SIPC 1859 and PUR 1680, please feel free to contact us at any time for more technical support and product information. Let Yilian adhesive provide more reliable protection for your products!
Tags: Dam enclosure adhesive · Dam enclosure adhesive · Circuit board enclosure adhesive · Circuit board sealing
