Condensation Cure
Condensation type electronic sealing adhesive is a type of material that solidifies through condensation reactions, usually formed by reacting silicone rubber or polyurethane resins with curing agents. The curing process usually releases small molecular substances such as water or alcohol. The main characteristics of this type of sealant are as follows:
Characteristic
* Curing method: The curing reaction of condensation sealant is usually carried out by heating or reacting with a curing agent at room temperature. During the solidification process, colloidal molecules interconnect and release small molecule substances.
* Longer curing time: Compared to addition molding sealant, condensation molding sealant usually has a longer curing time, especially in humid environments where the curing rate may be slower.
* Applicable environment: Suitable for applications with low curing temperature requirements, such as use under low or normal temperature conditions.
* Chemical stability: After curing, it has good chemical stability, heat resistance, and weather resistance, especially strong corrosion resistance in high humidity and acid-base environments.
* Disadvantage: During the condensation reaction, volatile substances such as water or alcohols may be released, which may corrode or affect the performance of sensitive electronic components.
Typical applications
* Silicone potting: For example, used for waterproofing, sealing, and insulation protection of electronic devices, home appliance components, sensors, etc.
* Transformers and power equipment: provide excellent insulation performance, high temperature resistance, and corrosion resistance.
* LED and lamp packaging: Provides waterproof, moisture-proof, and dustproof functions.
Addition Cure for Electronic potting compound
Additive electronic sealant is cured through addition reactions, such as those of silane, silane, or other monomers. The curing process does not involve the release of small molecules, so the curing reaction is very clean and does not produce volatile by-products. The characteristics of additive electronic sealant are as follows:
Characteristics:
Typical applications
* PCB protection: Provides waterproof, dustproof, and corrosion-resistant protection for sensitive circuit boards, commonly used in fields such as automotive electronics and communication equipment.
* Battery Pack Encapsulation: Used for battery pack encapsulation in electric vehicles or renewable energy fields, providing sealing, moisture-proof, fireproof and other functions.
* LED packaging: Due to its excellent transparency and high toughness, additive potting glue is widely used for packaging protection of LED lights.
Comparison of condensation type and addition type electronic potting compound.
Characteristics: | Condensation type electronic potting compound | Addition type electronic potting compound |
Curing reaction | condensation reaction, release of small molecules (such as water or alcohol), | Addition reaction without releasing small molecules |
The curing speed is slow and takes a long time to fully cure. | The curing speed is fast and can cure quickly at room temperature or heating | |
Applicable temperature: | Suitable for low temperature or room temperature curing. | Both high temperature and room temperature curing are acceptable |
Transparency | Low transparency, usually high in opaque materials, | usually transparent or semi transparent materials |
Environmental adaptability | Sensitive to moisture, and there may be moisture release during the curing process. | It is insensitive to moisture and does not release harmful substances during the curing process |
Mechanical properties | typically have good heat resistance, corrosion resistance, and electrical insulation. | Strong mechanical strength and resistance to yellowing |
Environmental friendliness | May release volatile substances, so attention should be paid to handling environmentally friendly. | Non-volatile substances, and the curing process should be clearer |
Summary
Condensed electronic potting adhesive and additive electronic potting adhesive each have unique advantages and application scenarios. Condensed adhesives are suitable for applications that require high environmental protection and longer curing times due to their excellent chemical stability, high temperature resistance, and corrosion resistance. Due to its rapid curing, clean and non-volatile by-products, and excellent transparency, additive adhesives are widely used in electronic devices that require high curing speed and long-term stability. Choosing the appropriate sealant requires comprehensive consideration based on actual application needs, environmental requirements, and performance indicators.
Tags: Additive Electronic potting compound · Electronic potting compound · Condensation Electronic potting compound
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