In the field of electronic manufacturing, PCB thin layer encapsulation is a key process. It not only plays a protective role in preventing moisture, shock, and leakage of electronic components, but also takes into account thermal conductivity, insulation, and long-term reliability.
PCB thin layer encapsulation
Recently, a customer encountered the following difficulties while developing a control circuit module:
🔹 Insufficient adhesion of sealing materials can lead to peeling after long-term operation
🔹 Traditional adhesives have high viscosity and are difficult to achieve thin layer self leveling and sealing
🔹 Poor thermal conductivity, severe heating of local components
🔹 The product must meet the UL94-V0 flame retardant rating and RoHS environmental certification
Solution: SIPC 9400
We recommend SIPC 9400 two-component condensed RTV silicone rubber to our clients.
This material has the following advantages:
PCB thin layer encapsulation
Excellent adhesion – can bond various materials such as metal, plastic, ceramic, glass, etc. without the need for additional primer; For special materials such as PP and PE, they can be combined with primer or surface treatment to enhance the effect.
Low viscosity self leveling – suitable for thin-layer sealing process, good fluidity, easy to operate two-component dispensing machine, can quickly cover PCB surface.
Thermal conductivity and flame retardancy – with a thermal conductivity coefficient of 0.6~1.0 W/m · K, it effectively improves heat dissipation efficiency and meets the UL94-V0 flame retardant standard.
Flexible and reliable – after curing, it forms a soft elastic body, which has the properties of resistance to cold and hot alternation, aging resistance, electrical insulation, and leakage resistance, and can operate stably and reliably for a long time.
Environmental Compliance – Compliant with RoHS environmental standards and adaptable to various electronic product certification requirements.
customer benefits
In practical applications, customers use SIPC 9400 for PCB thin layer encapsulation:
✅ Uniform sealing layer, no bubbles, stable process
✅ The reliability of the circuit board has significantly improved, with no detachment or cracking during long-term operation
✅ Temperature rise decreases, component lifespan extends
✅ Successfully passed flame retardant and environmental testing
In the end, the customer highly appreciated the performance of SIPC 9400 and plans to fully introduce it in future products.
📌 Conclusion
With the development of high-power and miniaturized electronic devices, the performance requirements for potting materials are also increasing.
SIPC 9400 provides an integrated solution for PCB thin layer encapsulation with its excellent adhesion, low viscosity flowability, and electrical properties.
👉 If you are looking for a sealing adhesive that combines thermal conductivity, flame retardancy, environmental friendliness, and reliability, SIPC 9400 would be the ideal choice.
Tags: PCB Thin Layer Encapsulation · Thin Layer Encapsulation
