In the field of electronic manufacturing, the sealing and sealing of connector PIN pins is a key step in ensuring the long-term stability and performance of products. Recently, we solved the challenge for a customer to simultaneously meet the complex requirements of reflow soldering heat resistance, high adhesion, low viscosity and easy sealing of the potting adhesive in a PA6+GF30% shell+PIN needle tin plated structure.
Customer Challenge
Special structure
The shell is made of PA6+GF30% reinforced nylon, and the surface of the PIN needle is plated with tin, which requires high adhesion of the adhesive and significant differences in thermal expansion coefficients between different materials.
Strict process requirements
It must undergo reflow soldering process, requiring the adhesive to have excellent high-temperature resistance and not bubble, crack or fail at high temperatures.
Sealing process restrictions
The sealing adhesive needs to have low viscosity (≤ 3000 mPa · s) to ensure smooth flow into the gap between the PIN needle and the housing, forming a complete seal.
Insulation and protective performance
It must have good electrical insulation performance and long-term stability against moisture and dirt.
Solution
We provide our customers with two high reliability organic silicone adhesive systems, which ultimately form the following technical matching:
Sealing and sealing of connector PIN pins
Option 1: SIPA 8715 adhesive sealant
Core advantages:
1: 1 two-component addition molding silicone, with strong adhesion, can be used with PA nylon without the need for a primer PBT、 Good adhesion of common polar materials such as tin plated copper
Low viscosity (better than 3000 mPa · s), excellent flowability, able to accurately fill small gaps
Can be cured at room temperature or by heating, convenient for flexible process adjustment
No by-products during solidification, avoiding bubbles and stress concentration
Wide working temperature range (-60 ℃~220 ℃), fully capable of reflow soldering thermal shock
Option 2: SIPC 9030 RTV sealant
Core advantages:
Single component neutral curing, room temperature moisture absorption curing
Good self leveling performance, convenient for large-scale automated coating
Excellent adhesion and strong sealing performance to copper and tin plating layers
Resistant to moisture, pollution, and aging, capable of long-term stable operation within the temperature range of -60 ℃ to 260 ℃
The lifespan can reach 20-30 years, suitable for outdoor or harsh environmental applications that require a long lifespan
Recommended reading: Practical cases of reinforcing automotive electronic connectors
Application effect
Reflow soldering visualization test: The encapsulation layer has no bubbles or cracking at a peak temperature of 260 ℃
Environmental testing: Through high and low temperature cycling (-55 ℃~125 ℃), wet heat aging (85 ℃/85% RH 1000h)
Insulation performance: After curing, the volume resistivity is greater than 10 ¹⁴Ω· cm, effectively reducing the risk of corona and leakage
In connector manufacturing, the selection of sealant cannot rely solely on a single performance indicator, but needs to be comprehensively considered:
Substrate type and surface treatment
Process requirements (such as reflow soldering heat resistance, encapsulation method)
Long term stability and reliability requirements
By accurately matching material characteristics and process requirements, not only can production efficiency be improved, but product lifespan can also be significantly extended and maintenance costs can be reduced in the later stages.
If you are also facing the challenge of matching special materials in the field of encapsulation and sealing, please feel free to contact our technical team, and we will provide you with personalized adhesive solutions.
Tags: Encapsulation and sealing of connector PIN pins · Encapsulation of connector pin pins · Encapsulation of connector pins
