Application of Silicon potting compound| Thin Layer Coating or Potting of PCB Circuit Board

In the manufacturing process of modern electronic products, PCB circuit boards (printed circuit boards) play a crucial role. With the continuous enhancement of electronic device functions, the design and manufacturing of PCB circuit boards have become increasingly complex, and the requirements for their protection and packaging have also become higher. Among these requirements, the application of PCB thin layer coating and encapsulation is particularly important, as they can effectively enhance the mechanical strength, seismic resistance, waterproofing, and corrosion resistance of the circuit board. To ensure the effectiveness of these applications, it is crucial to choose the appropriate adhesive. Today ELAPLUS will focus on introducing SIPC 1812 transparent silicone adhesive sealant, a high-performance adhesive sealant designed specifically for PCB thin layer coating or encapsulation.

ELAPLUS circuit board thin-layer encapsulation
The SIPC 1812 series sealant absorbs moisture from the air at room temperature and solidifies. It is a deoxime type silicone adhesive sealant made of special silicone rubber material as the base material and cannot be cured by heating. It has good adhesion and sealing performance for the vast majority of materials, protecting electronic products under harsh conditions.
Product Features
The cured elastomer of RTV 1812 series silicone adhesive sealant has the following characteristics:
✔ Resist moisture, dirt, and other atmospheric components
✔ Reduce mechanical stress and tension caused by mechanical, thermal shock, and vibration
✔ Excellent electrical insulation performance, anti corona
✔ Excellent outdoor aging resistance, with a service life of up to 20-30 years.

Application area

Application of Organic Silicon Sealing Adhesive | Thin Layer Coating or Sealing of PCB Circuit Board
a) Thin layer encapsulation of PCB boards and electronic devices; The bonding between the shell and the inner cavity of electronic cigarettes; Adhesive bonding of PC and acrylic lenses; LED lighting ncapsulation;
b) High temperature resistance requirements for industrial products such as steam irons, ovens, high-temperature air filters, high-temperature ovens, and high-temperature pipelines
label: LED lighting encapsulation · Thin layer encapsulation of PCB boards and electronic devices · Thin layer encapsulation of circuit boards