With the widespread adoption of active safety systems in automobiles, crash sensors have become an indispensable key component in the overall vehicle safety system. Collision sensors are usually installed on the front, longitudinal beams, or side structures, with extremely high requirements for signal stability, environmental adaptability, and structural strength.
In its internal structure, the sealing of the shell, the bonding and fixation of the circuit board, and the overall sealing protection are directly related to the stability of the sensor in high temperature, vibration, humidity, and impact environments. Therefore, it is crucial to choose appropriate potting adhesive, sealant, and circuit board bonding materials.
In response to the typical application requirements of collision sensors, Yilian has launched three high reliability materials:
PUR 1680, EP 1710, EP 1798- covering the entire application chain from shell sealing to PCB fixation to overall encapsulation.
01 Core requirements for adhesive used in collision sensors
The collision sensor has a compact structure and is sensitive to accuracy and response speed, therefore the following material requirements are proposed:
Low viscosity: suitable for sealing and flow with small gaps and complex structures
High adhesive strength: ensuring a strong bond between the circuit board and the housing
Low CTE (coefficient of thermal expansion): Avoiding stress damage caused by temperature changes
High temperature resistance level: suitable for environments in the engine compartment area of 150 ° C+
Excellent thermal conductivity: effectively disperses heat from electronic components
Long term aging resistance: resistant to moisture, salt spray, vibration, and impact
Compliant with vehicle regulations: such as UL94 V-0, H-grade temperature resistance, etc
Below we will introduce the optimal combination of adhesive for different working conditions.
02 Recommended products and application scenarios
PUR 1680- Lightweight choice for low viscosity potting, shell sealing, and circuit board bonding
Recommended applications: PCB bonding, shell sealing, small gap sealing
Product Features:
Ratio 100:16, low viscosity, excellent flowability, suitable for complex structure sealing
Can be used for shell sealing and circuit board bonding
Excellent adhesion to various substrates (PC, ABS, PA, metal, etc.)
High adhesive strength and good impact resistance after curing, suitable for collision sensor vibration scenarios
The cured appearance is smooth and can achieve precise dispensing
Low stress curing, does not harm PCB and sensitive components
EP 1710- Low CTE (20) · Thermal conductivity 1.0 W/M · K · Preferred for encapsulation of automotive grade electronic modules
Recommended applications: power device encapsulation, sensor internal structure filling, circuit board fixing
Core performance highlights:
Two component (100:8) epoxy sealant
Ultra low CTE=20, effectively reducing thermal expansion stress
Thermal conductivity of 1.0 W/m · K, suitable for collision sensor modules with high heat dissipation requirements
Viscosity of only 2000 cPs, good flowability, able to enter small gaps
Long term use temperature of 150-180 ° C, meeting the long-term temperature resistance requirements of the engine compartment
After curing, the structure is strong and resistant to chemicals
EP 1798- UL94 V-0 flame retardant · low CTE (21) · 8-hour operating time · H-grade temperature resistance
Recommended applications: Sensor overall encapsulation, weather resistant sealing, automotive grade high reliability applications
EP 1798 is a flagship potting material suitable for high reliability collision sensors.
Product Highlights:
Two component (5:1) epoxy system
Low viscosity (2000 cPs), easy to encapsulate
Flame retardant grade UL94 V-0, meeting the safety requirements of vehicle regulations
Low CTE=21, suitable for sensor scenarios with severe temperature shock
H-class temperature resistance level (180 ° C), supporting long-term operation of the engine compartment
The operation time is up to 8 hours, suitable for large-scale factory batch sealing production
Comparison of application positioning of three materials in 03
Recommended materials and technical reasons for application scenarios
Shell sealing+small gap bonding PUR 1680 low viscosity, strong adhesion, good flexibility
Need thermal conductivity/low CTE EP 1710 CTE=20, thermal conductivity 1.0, temperature resistance 180 ° C
High flame retardancy+high temperature resistance EP 1798 UL94 V-0, CTE=21, H-grade temperature resistance
04 Advantages of choosing Yilian
Automotive electronic adhesive has been deeply cultivated for many years
Complete material verification capability: resistance to moisture and heat, thermal shock, thermal cycling, CTE testing, salt spray, vibration
Support proofing, viscosity adjustment, gel time adjustment, OEM customization
National fast supply, compatible with Tier1/OEM standards
As one of the most critical sensitive components in automotive safety systems, collision sensors have extremely strict requirements for sealing and adhesive materials. From small gap bonding and shell sealing to high reliability overall sealing,
The three automotive grade materials PUR 1680, EP 1710, and EP 1798 can build a complete one-stop solution, providing long-term stable and reliable security for OEMs and Tier1.
If you are looking for:
Collision sensor sealant
Adhesive for circuit board bonding
Low CTE potting material
Vehicle grade high-temperature sealing adhesive
Feel free to contact us anytime for samples or process suggestions.
Tags: ep 1710 · EP 1798 · pur 1680 · Shell sealant · Thermal conductive sealing material · Automotive collision sensor · Recommended sealing adhesive · Circuit board adhesive
