In the continuous upgrading of new energy vehicles, energy storage equipment, and intelligent manufacturing equipment, the stability of the wire harness PCB directly determines whether the system can operate stably in complex environments such as high temperature, vibration, and humidity for a long time. In order to ensure the weather resistance and reliability of the wiring harness board, the encapsulation process has become an indispensable part.
Adhesive for wiring harness board sealing
In the face of changing application environments, engineers often make the following requirements for sealant:
✔ Having certain thermal conductivity to avoid heat accumulation affecting the lifespan of electronic components
✔ The adhesive strength does not need to be too high, but it should maintain flexibility and fatigue resistance
✔ Two component addition molding silicone system, combining low stress and high reliability
✔ Fast curing speed, improving production line efficiency
If you are looking for a material that meets the above requirements – SIPA 1850 gray is worth paying close attention to.
Recommended product: SIPA 1850 gray thermal conductive sealant
SIPA 1850A/B is a two-component addition molding silicone sealant designed specifically for electronic modules, high-temperature devices, and wiring harness boards. Its 1:1 mixing ratio, excellent fluidity, and good thermal stability make it highly suitable for convenient and efficient sealing processes.
🔹 Core Features
Two component addition molding silicone system, uniform curing, no shrinkage
1: 1 ratio, automatic mixing machine and manual operation are both very convenient
Low hardening shrinkage rate to avoid damage to solder joints or components under stress
Excellent high-temperature electrical insulation ensures long-term stability of the wiring harness board
Good thermal conductivity, meeting general heat dissipation needs
Strong waterproof and moisture-proof performance, improving the reliability of the whole machine
Flame retardant rating UL 94 V-0, meets automotive electronic safety regulations
Strong deep curing ability, suitable for large volume sealing
Compliant with ROHS/SVHC REACH environmental regulations
View SIPA 1850 details
Typical application areas
SIPA 1850 gray is particularly suitable for potting low to medium power modules that require thermal conductivity, moisture resistance, and insulation protection:
Vehicle wiring harness board, automotive electronic module
LED power driver module
Solar module junction box
Electric vehicle charging station module
Lithium battery pack, capacitor pack
High frequency magnetic induction coil
Inverter, on-board OBC, power conversion module
For scenarios that require both thermal conductivity and high adhesive strength for wire harness board encapsulation, SIPA 1850 gray is a very suitable material choice. Its advantages include:
✔ Good fluidity and fast solidification
✔ Additive molding system is safe and reliable
✔ Meet the requirements of automotive grade flame retardancy and environmental protection
✔ Long lifespan, temperature stability, non corrosive components
Whether it’s automotive electronics, energy storage devices, or new energy electronic control modules, SIPA 1850 can bring higher stability and efficiency to your encapsulation process.
Tags: SIPA 1850 potting adhesive · UL94V0 flame retardant potting adhesive · additive silicone · two-component silicone potting · thermal conductive potting silicone · fast curing potting adhesive · module potting material · automotive electronic potting adhesive · wiring harness board potting adhesive
