In the packaging protection of pressure sensors, the fluidity, viscosity, and stress release ability of the sealing adhesive often determine the long-term stability and reliability of the sensor. Especially in the face of complex environmental conditions (high humidity, high temperature, mechanical vibration), it is particularly important to select a suitable silicon gel.
Today, we recommend a high-performance potting material SIGEL 1805 two-component addition molding silicon gel specially designed for pressure sensors, MEMS chips and precision circuit modules.
Load cell gel encapsulation
Load cell gel encapsulation
1、 Product Features Highlights
✅ Soft and elastic, excellent cushioning
After curing, it forms a soft elastic body that can release mechanical stress under thermal cycling and vibration conditions, protecting the chip and leads from damage.
✅ Excellent electrical insulation and protection performance
After curing, it has extremely low oil leakage and excellent dielectric properties, which can effectively isolate moisture and corrosive media, providing stable insulation protection for high-voltage circuits.
✅ Outstanding aging resistance and weather resistance
Long term exposure to high temperature, high humidity, ozone, and ultraviolet environments results in stable performance, making it suitable for outdoor or automotive electronic sensor applications.
✅ 1: 1-ratio additive curing system
Easy to mix, no by-products, low shrinkage rate, mild curing process, can be cured at room temperature or by heating, compatible with automatic glue filling production lines.
2、 Typical application scenarios
🔸 Pressure sensor encapsulation: used for overall protection of silicon-based chips and circuit board areas, preventing moisture intrusion and mechanical stress damage.
🔸 Differential pressure/air pressure sensor packaging: Provides flexible buffering in the packaging cavity to ensure measurement sensitivity and long-term stability.
🔸 MEMS、 Micro sensor module: provides stress relief and protective barriers for sensitive components.
🔸 Automotive electronic module: suitable for high temperature and high humidity working conditions such as wheel speed sensors and intake pressure sensors.
Application case of gel potting
4、 Analysis of Technical Advantages
Leak proof design: The high viscosity system avoids overflow or bottom leakage caused by excessive flow, and is suitable for small-sized sealing chambers.
Flexible stress absorption: Buffer structural stress, thermal expansion differential stress, and improve sensor accuracy and stability.
High insulation protection: provides a stable dielectric environment for sensor signal circuits, preventing drift or breakdown caused by moisture.
Reliable and durable: Long term resistance to high temperatures, humidity, and chemical corrosion, suitable for industrial, automotive, and outdoor instrument fields.
5、 Application Cases
In a certain industrial pressure sensor encapsulation project, the customer previously used low viscosity silicone gel, which caused leakage at the bottom of the encapsulation cavity. After replacing with SIGEL 1805, the sealing adhesive can remain stable in the set area and form a uniform and transparent protective layer after curing. After 1000 hours of wet heat aging test at 85 ℃/85% RH, the electrical performance of the product is stable and the signal has no drift.
load cell
For pressure sensor packaging applications that require high viscosity, high elasticity, and insulation protection,
SIGEL 1805 provides an ideal solution:
✔ Leak proof sealing
✔ Soft cushioning
✔ Resistant to aging and oil leakage
✔ Adapt to automated production
Enable every sensor to withstand the test of time and environment.
Label: silicone gel · potting gel · weighing sensor gel potting
