In the packaging process of electronic devices, the transistor serves as a key component for controlling current amplification, and its stability directly affects the reliability and lifespan of the entire machine. Especially in high-frequency, high temperature, and high humidity environments, traditional packaging materials are prone to problems such as cracking, leakage, or performance degradation. Therefore, choosing a stable and durable potting adhesive is crucial.
Transistor packaging
1、 Application background
Power type transistors often experience continuous current surges and temperature fluctuations during operation. Its internal structure is complex and requires extremely high requirements for the sealing material. It not only needs to have good electrical insulation performance, but also needs to maintain adhesive strength and structural integrity under long-term thermal cycling.
The sealing material previously used by the customer is prone to microcracks during high-temperature aging testing, resulting in an increase in transistor leakage rate and a decrease in insulation resistance, which seriously affects the product qualification rate. For this reason, they chose to try the EP 1700A/B epoxy sealant with better performance.
2、 Material characteristics
EP 1700A/B epoxy potting adhesive is a 1:1 ratio heating curing potting material that can be stored at room temperature and maintain fluidity even after low-temperature mixing, making it convenient for mass production. Its key advantages include:
Excellent high temperature resistance
After curing, the material can stably withstand high temperature environments without softening or deformation, and is suitable for long-term operation of power devices.
Outstanding mechanical performance
The cured material has strong toughness, impact resistance, and vibration resistance, which can effectively absorb thermal stress and avoid cracking of the packaging layer caused by mismatched thermal expansion coefficients.
Excellent protective performance
It has excellent moisture, water, oil, and dust resistance, and can resist acid and alkali corrosion, ensuring long-term stable operation of the device in harsh environments.
Excellent electrical characteristics
After curing, it has high insulation, good compressive strength, and dielectric properties, which can effectively prevent breakdown and short circuit, ensuring circuit safety.
Environmental Protection and Operability
The total chlorine content of colloids is low, which meets environmental standards; 1: The mixing ratio of 1 is convenient for automated glue production.
View EP 1700 epoxy adhesive details
3、 Application process and test results
The customer applies EP 1700A/B to the overall packaging of transistor chips and pins. By vacuum sealing, the adhesive evenly covers the entire surface of the component and forms a high-strength protective layer after curing.
In the subsequent performance verification:
Cold and hot cycling test (-40 ℃~125 ℃, 500 cycles) without cracking;
After 1000 hours of high humidity aging at 85 ℃/85% RH, the insulation resistance remains stable;
The dielectric strength test reached an excellent level, and the leakage current significantly decreased after packaging.
In the end, the packaged transistor passed the customer’s full set of reliability tests, resulting in a product yield increase of over 15%, meeting their shipping standards for high-end power devices.
EP 1700A/B epoxy potting adhesive is an ideal choice for transistor packaging due to its excellent temperature resistance, mechanical strength, and protective capabilities. Whether in automotive electronics, industrial control, or communication equipment, it can provide stable structural support and long-term electrical protection for devices.
If you are looking for an epoxy potting material that combines high temperature resistance, moisture resistance, shock resistance, and insulation performance, Yilian EP 1700A/B will be a reliable solution.
Tags: transistor encapsulation and sealing adhesive · epoxy encapsulation adhesive · electronic device encapsulation material · high temperature resistant epoxy adhesive · moisture-proof and shockproof encapsulation adhesive
