In the context of rapid development of modern electronic products, electronic devices have put forward higher requirements for the performance of potting adhesives – not only to have excellent electrical insulation performance, but also to withstand long-term tests in harsh environments such as high temperature, vibration, and humidity. Today, Elaplus will share an application case of the EP 1700 A/B two-component epoxy potting adhesive launched by ELAPLUS, focusing on its outstanding performance in high-temperature electronic component potting, providing a one-stop reliable packaging solution for the electronic manufacturing industry.
Project Background: Packaging Challenges of High Temperature Resistant Electronic Components
A certain industrial control equipment manufacturer has long faced a thorny problem: its main control circuit board needs to operate stably in a long-term high temperature (working environment temperature is maintained above 130 ℃) and complex electromagnetic interference environment. Traditional single component epoxy or silicone sealing materials frequently experience cracking, decreased adhesion, and even surface carbonization during high-temperature aging testing, seriously affecting product stability and after-sales maintenance costs.
High temperature resistant epoxy sealant
After multiple rounds of scheme screening, the customer ultimately chose the EP 1700 A/B two-component heat cured epoxy potting adhesive launched by ELAPLUS for verification and achieved successful application.
Product selection: Why EP 1700 A/B?
EP 1700 A/B is a two-component epoxy resin sealant designed specifically for high reliability electronic devices, with the following core advantages:
Excellent high-temperature stability: The glass transition temperature (Tg) of the cured material can reach 150 ℃, making it suitable for high-temperature conditions.
Excellent mechanical performance: hardness ≥ 80 Shore-D, shear strength ≥ 8MPa, able to withstand mechanical impact and vibration after sealing.
Strong electrical insulation performance: volume resistivity up to 1.0 × 10 ¹⁵Ω· cm, dielectric strength>15KV/mm, ensuring the safety of high-voltage devices.
All round protection: It has strong resistance to damp and heat, moisture, dust, oil, acid and alkali, and aging.
Application achievements: Performance improvement+reduced failure rate
The control module sealed with EP 1700 A/B has undergone multiple rounds of aging, wet heat, and salt spray tests, and its performance is as follows:
No cracking or failure after 1000 hours of high-temperature aging;
Waterproof level reaches IP67 or above standard;
No adhesive layer peeling occurs during environmental cycling from -40 ℃ to+150 ℃;
The overall failure rate has decreased by over 70%, and the customer return rate has significantly decreased.
At the same time, the excellent operating window and low-temperature storage characteristics of EP 1700 A/B (which can be stored below -10 ℃ after mixing) greatly improve the production flexibility and efficiency of customers.
Summary: ELAPLUS EP 1700- The Trusted Choice for High Temperature Encapsulation of Electronic Devices
From the case, it can be seen that ELAPLUS EP 1700 A/B two-component epoxy potting adhesive not only solves the packaging problem at high temperatures, but also provides customers with a true “high stability solution” with its high mechanical strength and excellent electrical insulation performance. For any electronics manufacturer pursuing product durability and performance consistency, EP 1700 A/B is undoubtedly a product worth considering.
If you need to obtain product information or samples, please visit the official website www.elaplus.comc or call the customer service hotline at 021-67227200 for more technical support.
Tags: thermosetting epoxy sealant · epoxy sealant · high temperature resistant sealant
