Up to 55% of electronic product failures are caused by heat
Most electronic products, such as power transistors, CPUs, and power diodes, generate a significant amount of heat, which may need to be considered in order to extend their lifespan and improve reliability.
During operation, the temperature of electronic components will rise until the heat generated inside the device equals the heat dissipated to the surrounding environment, and the device reaches equilibrium. The temperature may be high enough to significantly shorten the shelf life of components and even cause equipment failure.
The result of temperature rise will affect the operation of active and passive components in integrated circuits. If the temperature rises high enough, the heated active or passive components may not function properly or even fail completely. This type of failure includes thermal runaway, junction failure, metallization failure, corrosion, resistance drift, and electromigration diffusion. Therefore, minimizing temperature rise in electronic packaging is crucial.
What causes the temperature of electronic packaging to rise?
Improve power density and current
The insatiable demand for higher performance processors has led to a steady increase in power consumption in all segmented markets, such as mobile and high-performance desktops, as well as servers and workstations. The increasing power density and current levels in microprocessors have always been the main heat sources, causing concerns about thermal management of on-chip hotspots, packaging, and interconnect Joule heating.
PCB surface component density is higher
Another reason why thermal management of electronic circuit boards has attracted attention is that the electronics industry is witnessing a trend of handheld devices and household appliances becoming thinner and smaller. That’s why PCBs are becoming more compact, and the space between components on electronic PCBs is getting closer, making it harder to transfer heat from PCB components.
So what if the radiator is not enough?
Maximizing the contact area between the radiator and the cooling medium
Maximizing the contact area between the radiator and the cooling medium
One way to limit the working temperature is to artificially increase the surface area. This is accomplished by connecting a metal heat sink to the device. The choice of heat sink is very important because the outcome depends on many factors, including heat sink material, size, conductivity, design, and the adhesive used to bond it to the PCB.
Air is a poor conductor of heat, so the interface will provide a thermal barrier, limiting the heat loss efficiency of the equipment. To overcome this influence, thermal conductive compounds were used.
Thermal conductive materials are designed to fill the gap between the device and the heat sink, thereby reducing the thermal resistance at the boundary between the two. This will result in faster heat loss from the radiator and lower the operating temperature of the equipment. In the field of electronics, these thermally conductive compounds are referred to as thermal interface materials (TIMs).
TCMP GP 35 # High Performance Thermal Conductive Interface Composite Material
TCMP GP 35 # is a high thermal conductivity material with a thermal conductivity of 3.5W/mk. It has good thermal conductivity and surface wetting properties, and is ultra soft, easy to operate, and die cut; Low interface thermal resistance performance can be achieved at relatively low pressures. Applied between power devices and heat dissipation aluminum sheets or machine casings, it can effectively eliminate air and achieve good filling effect.
Basic characteristic typical value execution standard
Thickness 0.3~7.0, visually assessed
Density (g/cm3) 3.1 ASTM D792
Hardness (Shore 00) 50-70 ASTM D2240
Flame retardant grade V-0 UL 94
Working temperature (℃) 40 to 150 N/A
Volume resistivity (Ω. cm) 4.2 × 1010 ASTM D257
Elaplus product features
Product Features:
▶ Good gap filling ability, low thermal resistance
▶ Thermal conductivity 3.5W/mk
▶ Soft and compressible
▶ UL94 V-0 flame retardant rating
▶ Double sided micro adhesive, easy to operate
Label: thermal conductive gel · thermal conductive gasket · thermal conductive potting glue · thermal conductive silica gel · thermal conductive silicone grease
