Efficient thermal management is crucial in electronic and semiconductor manufacturing, as overheating can affect performance and lifespan. Thermal conductive adhesive (TCA) can simultaneously bond components and dissipate heat, providing a disruptive solution without the need for additional mechanical fastening, making it an ideal choice for modern electronic applications.
Related article: Frequently Asked Questions about Thermal Conductive Adhesive – Elaplus Electronic Adhesive
What is Thermal Conductive Adhesive (TCA)?
Thermal conductive adhesive (TCA) is a specialized adhesive that contains thermal conductive fillers (such as alumina, boron nitride, or silver particles) suspended in a polymer matrix in its formula. This type of adhesive has a dual function:
Strong adhesion between electronic components.
Efficient heat dissipation to prevent overheating.
Unlike thermal grease or thermal paste, TCA forms a strong and stable adhesive after curing, and can remain durable for a long time, making it an ideal choice for high-performance electronic applications.
The main advantages of thermal conductive adhesive
Simplified assembly process: Unlike thermal paste that requires additional mechanical fastening, TCA can simultaneously bond and dissipate heat, simplifying the assembly process and reducing manufacturing complexity.
Enhance heat dissipation: TCA has high thermal conductivity (usually ≥ 1 W/m · K), which can effectively transfer heat from critical components to radiators or cooling systems.
Reliable mechanical bonding: These adhesives provide strong adhesion to various substrates, including silicon chips, aluminum, copper, ceramics, and plastics, ensuring long-term stable connections.
Improved electrical insulation: Many TCAs have electrical insulation that prevents short circuits while maintaining excellent thermal performance.
Durability and environmental resistance: The design of thermal conductive adhesive can withstand:
High operating temperature (suitable for power electronics).
Mechanical vibration (applicable to automotive and aerospace applications).
Humidity, chemicals, and environmental pressure.
Save weight and space: By replacing bulky heat sinks, clips, and mechanical fasteners, TCA helps achieve lighter and more compact designs – which is particularly important for small electronic products.
The application of thermal conductive adhesive in the fields of electronics and semiconductors
Thermal conductive adhesive is widely used in high-tech industries that require efficient heat dissipation and strong bonding. Here are some common applications of TCA in the electronics and semiconductor industries:
- Adhesive bonding between integrated circuits (ICs) and power transistors
Bonding substrates: copper, aluminum, ceramics
requirement:
High thermal conductivity (≥ 1.0W/m · K) can effectively conduct heat away from ICs and power transistors.
Has strong adhesion to metal and ceramic surfaces, and can maintain durability for a long time.
Electrical insulation performance to prevent short circuits.
Fast curing time (7-10 minutes), improving production efficiency.
Resistant to high working temperatures to ensure stable performance. - Silicon wafer bonding in high-performance chip manufacturing
Bonding substrate: silicon wafer – E-Coat AL, silicon wafer – NPS
requirement:
High bonding strength (≥ 18MPa) ensures the integrity and stability of the wafer.
Excellent thermal conductivity, capable of managing the heat dissipation of high-performance chips.
The minimum thermal expansion mismatch can prevent stress fracture.
High purity formula can prevent contamination in semiconductor manufacturing.
Reliable performance and durability at high temperatures.
Silicon wafer bonding in high-performance chip manufacturing - Install the heat sink onto the semiconductor component
Bonding substrate: silicon wafer, copper, aluminum
requirement:
Excellent heat dissipation performance can transfer excess heat from sensitive semiconductor components.
High adhesive strength, can maintain mechanical stability during long-term use.
Heat resistant cycling to prevent delamination under extreme conditions.
Fast processing time (7-10 minutes), improving production efficiency.
High thermal conductivity (≥ 1W/m · K) can achieve optimal heat sink performance. - Cooling of power modules, IGBTs, and MOSFETs in high-voltage applications
Bonding substrates: copper, aluminum, ceramics, silicon
requirement:
High thermal conductivity, capable of effectively cooling power modules under high electrical loads.
Has strong adhesion to metal and ceramic surfaces, which can maintain structural integrity.
Electrical insulation performance to prevent arcing and short circuits.
High temperature resistance, able to withstand extreme operating environments.
Suitable for vibration and mechanical shock resistance in automotive and industrial applications.
Thermal conductive adhesive product combination
Our thermal conductive adhesive product portfolio offers a range of high-performance bonding solutions designed to meet the stringent requirements of electronic, semiconductor, and power electronics applications.
The choice of suitable thermal conductive adhesive depends on specific application requirements and environmental conditions. Each material has its own advantages and is suitable for different needs in manufacturing and use processes. With years of experience in the field of industrial materials, ELAPLUS is always ready to assist customers in selecting suitable thermal conductive adhesives and provide integrated solutions for production lines to optimize production efficiency. Please contact us for free consultation.
Tags: Thermal Conductive Materials · Thermal Conductive Silicone · Thermal Conductive Adhesive · Electronic Thermal Conductive Adhesive
