In modern industrial manufacturing, pressure sensors are widely used as key detection components in fields such as automotive, aerospace, medical equipment, and industrial automation. However, these high-precision devices have extremely demanding requirements for material selection and processes, especially in the application of adhesives.
We will discuss two adhesives that are particularly suitable for the production of pressure sensors – SIGEL 1806 for gel encapsulation and EP 1738 for shell bonding, and show how they can help enterprises improve product quality and production efficiency through specific cases.
Demand for gel potting
The internal circuit board of the pressure sensor requires a sealing material that can provide protection to prevent damage to sensitive components from external environments such as humidity, dust, vibration, etc. At the same time, the sealing material must have low stress characteristics to avoid damaging precision components due to mismatched thermal expansion coefficients.
The difficulty of shell bonding
The housing of a pressure sensor is composed of two materials: metal and plastic. Traditional adhesives are difficult to achieve strong bonding and require stability under extreme conditions of high and low temperatures. In addition, the customer wishes to simplify the production process and reduce the curing time.
Customized solution: Double material combination solves technical problems
After on-site testing by our technical team, a targeted combination solution of “sealing+structural bonding” has been proposed:
▶ Core protective layer: SIGEL1806 gel potting adhesive
Innovative low modulus formula (penetration degree 70) effectively absorbs mechanical stress
Maintain elasticity over a wide temperature range of -60 ℃ to 200 ℃
3D stereoscopic coating technology achieves “zero damage” protection for sensitive components
Thixotropic index>4.5, no sagging during vertical surface construction, and the sealing qualification rate has been increased to 99.2%
▶ High strength adhesive layer: EP 1738 epoxy adhesive
Single component thermosetting design (120 ℃/60min), increasing production line efficiency by 40%
Shear strength>18MPa, according to MIL-STD-810G vibration standard
Chemical resistant properties: resistant to oil, coolant, and salt spray erosion
CTE coefficient of thermal expansion accurately matches metals and engineering plastics
In the era of intelligent sensing, adhesives have been upgraded from auxiliary materials to core functional components. We continue to deepen our expertise in the field of electronic adhesives and have now formed a complete solution library covering sensing, energy storage, and microelectronics. Click on the official website to obtain the “White Paper on Selection of Sensor Adhesive”, or make an appointment with an engineer for free sample evaluation.
Label: low stress adhesive · gel potting · pressure sensor adhesive · shell bonding
