In the field of modern industrial electronics, especially in semiconductors and electronic components, thermistors (NTC or PTC) are one of the important components. They have a wide range of applications in temperature control, over temperature protection, and current limiting. With the advancement of technology, the precision and performance requirements of semiconductor thermistors continue to increase, and the requirements for their packaging materials are becoming increasingly strict.
Especially in working environments with high temperatures, vibrations, and complex external environmental conditions, thermistors require strong protection to ensure their long-term stable operation. Therefore, the selection of encapsulation materials is crucial, as they can provide temperature stability, mechanical protection, and reliable electrical insulation.
Encapsulation of semiconductor thermistor
Challenge
Semiconductor thermistors face multiple challenges in their applications, including:
▶ Temperature fluctuations: Electronic devices generate a large amount of heat during operation, especially high-power circuits. Thermistors must be able to cope with constantly changing temperatures to prevent performance degradation or damage caused by overheating or rapid temperature changes.
▶ Mechanical vibration: Modern industrial equipment often operates in harsh environments, which may cause thermistors to experience vibrations, impacts, or other mechanical stresses during use.
▶ Long term stability: After long-term operation of semiconductor components, the packaging material needs to maintain high performance to avoid performance degradation caused by aging, temperature cycling, and other factors.
Recommended products
Yilian EP 1761 series is a single component high-performance epoxy resin structural adhesive developed for the trend of miniaturization, lightweight, and high output in power, electrical, and electronic equipment.
Suitable for structural bonding and reinforcement bonding of small industrial products, such as assembly bonding of ferrite and magnetic steel in the production of magnetic motors, bonding and fixation of motor rotor necks and motor winding coil joints. Compared with widely used anaerobic adhesives and two-component acrylic adhesives, it has better electrical, chemical, and thermal physical properties. Its excellent operational performance can further cope with the automation and high-speed of assembly technology. Widely used in various electronic devices, including semiconductors, relays, motors, inductors, coils, pickups, and more.
Product Features
▶ Good storage stability under normal temperature conditions
▶ Rapid curing under heating conditions
▶ After curing, it has strong toughness, high bonding strength, impact resistance, and vibration resistance at the bonding site
▶ Good acid and alkali resistance, moisture and water resistance, oil and dust resistance, moisture and humidity resistance, and atmospheric aging resistance
▶ Has good insulation and compression resistance
When facing various challenges in the modern industrial electronic environment, EP 1761 epoxy resin provides excellent protective performance with its advantages of low CTE, high thixotropy, and high-temperature curing, ensuring the stability and long-term reliability of semiconductor thermistors in harsh environments. Its high temperature stability, mechanical shock resistance and aging resistance make it an ideal packaging material, suitable for various high demand industrial electronic applications.
If you are looking for a packaging material that can provide efficient protection for semiconductor thermistors, EP 1761 is undoubtedly your best choice.
Tag: Thermistor Encapsulation · Epoxy Structural Adhesive
