In the field of industrial electronics, miniature inductors are often used in various precision equipment, especially in communication, automation control, and electronic control systems for new energy vehicles. Ensuring the reliability and stability of micro inductors under extreme conditions such as high temperature, low temperature, and mechanical vibration has always been a major challenge in electronic component design, as they need to withstand various harsh working environments.
In order to ensure the long-term stability of micro inductors, packaging and fixing techniques have become the key to solving this problem. The selection of sealant needs to consider multiple aspects, including adhesive strength, toughness, thermal stability, seismic resistance, etc. Choosing the appropriate sealant can significantly improve the anti-interference ability, seismic resistance, and temperature resistance of inductors.
In this situation, the main challenge faced by the customer is how to improve the stability of the miniature inductor under extreme temperature changes, while ensuring that the inductor will not be damaged under mechanical vibration and impact. Specific issues include: material expansion under temperature difference changes: Micro inductors often operate in high and low temperature environments, and expand and contract during temperature changes, which can easily lead to stress concentration in components and affect the stability of inductors. Seismic requirements: Inductors must have certain seismic resistance in practical use, especially in electric vehicles and high vibration environments, to prevent solder joint breakage or inductance detachment. Environmental tolerance: Micro inductors are often exposed to extreme working environments, such as high temperatures, high humidity, or dusty environments in automotive electronic control systems. Therefore, sealing materials must have excellent properties such as high temperature resistance, low temperature resistance, water resistance, and corrosion resistance.
Recommended product
EP 1735 is a low viscosity single component epoxy structural adhesive, black in color and solvent-free. It has high adhesive strength, low coefficient of linear expansion, good toughness, and high temperature and low temperature impact resistance. It can cure quickly at medium to low temperatures.
Micro inductor encapsulation
Specific product parameters
Item Testing Methods or Conditions EP 1735
Product Code -1735010
Before solidification
Appearance Inspection Visual black paste
Viscosity mPa · s, 25℃ 16,000-24,000
Density g/cm3, 25℃ 1.45-1.55
Hardness Shore-D, 25℃ 85±5
After curing
Glass transition temperature Tg, DSC, ℃
Curing process 120 ℃/60 min 110
Curing process 120 ℃/30 min 108
Curing process 100 ℃/40 min 98
Long term temperature resistance range ℃ -50-150
Shear strength,
Steel steel MPa, 25 ℃, curing process 120 ℃/60 min ≥ 15
MPa, 25 ℃, curing process 120 ℃/30 min ≥ 13
MPa, 25 ℃, curing process 100 ℃/40 min ≥ 10
Thermal conductivity coefficient W/m.k, 25℃ 0.45
Water absorption rate of 24 hours,at 25 ℃ 0.13%
Linear expansion coefficient ppm 35< Tg90, >Tg
Volume resistivity Ω· cm, DC500V 5.8×1014
After using the Beginor EP 1735 epoxy structural adhesive, the performance of the miniature inductor has been significantly improved, especially in temperature differences and high vibration environments, where the stability and lifespan of the inductor have been greatly extended. This solution not only solves the customer’s difficulties in anti-interference and seismic resistance of electronic components, but also improves production efficiency and reduces repair rates.
EP 1735, with its low coefficient of expansion, high adhesive strength, excellent impact resistance, and rapid curing characteristics, has become an ideal choice for micro inductor encapsulation and fixation. This case not only demonstrates the technological advantages of Beginor products, but also highlights the important role of potting adhesive in modern industrial electronic applications.
Tags: Miniature Inductance Encapsulation · Inductance Encapsulation
