With the rapid development of electronic technology, the functions of various electronic devices have become increasingly complex, and higher requirements have been put forward for the stability and reliability of their performance. Especially in the packaging process of power modules and electronic components, the selection of encapsulation materials is crucial. The power module not only needs to withstand fluctuations in current, but also needs to cope with environmental pressures such as high temperature and high humidity. Therefore, the sealing material not only needs to have high hardness to prevent physical damage, but also needs to have excellent flame retardancy and waterproof and moisture-proof capabilities to ensure long-term stable operation of the equipment in various harsh environments.
With the rise of emerging industries such as electric vehicles, 5G communication equipment, and smart homes, the working environment faced by power modules has become more complex. For example, in electric vehicles, the battery and power module need to maintain stable performance in multiple harsh environments such as high temperature, humidity, and vibration; In communication equipment, modules must not only have high temperature resistance, but also ensure long-term electrical stability and anti-interference. Therefore, selecting appropriate sealing materials has become the key to ensuring the long-term stable operation of electronic devices.
Power sealing adhesive faces challenges
✔ Hardness and protective balance
High hardness is required to prevent physical damage while maintaining appropriate toughness to avoid material embrittlement.
✔ Flame retardancy and safety
In environments with high temperatures or potential fire risks, it is necessary to ensure that the sealing material has flame retardancy to prevent the spread of fire.
✔ Waterproof and moisture-proof
High water absorption may lead to decreased performance or corrosion of electronic components, and waterproof and moisture-proof properties become key requirements.
✔ High temperature resistance and adaptability
The power module often operates in high temperature environments, and the material needs to withstand a short period of 150 ° C high temperature.
✔ Long term stability and reliability
The material needs to maintain stable performance during long-term use to avoid equipment failure caused by environmental changes.
Recommended products for power sealing
EP 1712A/B is a two-component solvent-free ambient temperature curing epoxy potting material. After mixing, it has moderate flowability, certain leak proof characteristics, and a wide range of adhesiveness. The cured product meets UL 94V-0 flame retardancy.
Product Features:
▶ Good toughness and high hardness
▶ Excellent adhesion and cracking resistance
▶ Excellent electrical insulation and stability stability
▶ Good waterproof and moisture-proof properties, with extremely low water absorption rate
▶ Good temperature resistance, able to withstand temperatures up to 150 degrees Celsius in a short period of time
Elaplus EP 1712 epoxy potting material provides comprehensive protection for your power modules and electronic devices with its high hardness, flame retardancy, leak resistance, and electrical isolation characteristics. Whether it’s temperature resistance, moisture resistance, flame retardancy, or crack resistance, EP 1712 can meet your high standard requirements.
Tags: Thermal potting · potting Materials · Power potting
