Thermal conductive adhesive, as an efficient thermal conductive material, plays an important role in modern industry and electronic technology, significantly improving equipment heat dissipation performance and extending product service life. This article will provide a detailed introduction to the thermal conductivity efficiency of thermal conductive adhesive and its influencing factors, and analyze its wide application and selection points.
Thermal conductive adhesive
1、 Definition of Thermal Conductivity Efficiency of Thermal Conductive Adhesive
The thermal conductivity efficiency of thermal conductive adhesive usually refers to its ability to transfer heat from high temperature areas to low temperature areas. This ability is mainly determined by the thermal conductivity of the thermal conductive adhesive, measured in W/m · K (watts per meter Kelvin). The higher the thermal conductivity, the faster and more effective the thermal conductive adhesive can transfer heat, and the stronger its heat dissipation performance.
In practical applications, thermal conductive adhesive not only relies on the thermal conductivity of its material itself, but also involves multiple factors such as coating thickness, compactness after curing, and thermal resistance between it and the contact surface.
2、 Key influencing factors of thermal conductivity efficiency of thermal conductive adhesive
Usage environment
The usage environment of thermal conductive adhesive, such as working temperature, humidity, mechanical stress, etc., can also affect its thermal conductivity efficiency. For example, in high-temperature environments, thermal conductive adhesives need to have higher temperature resistance to ensure their long-term stable thermal conductivity.
Thermal conductive adhesive
3、 Typical application areas of thermal conductive adhesive
Heat dissipation of electronic components
Thermal conductive adhesive is widely used in the heat dissipation system of electronic components such as chips, processors, and power modules. By transferring heat from the heat source to the heat sink or radiator, the operating temperature of the device can be significantly reduced, avoiding performance degradation or failure caused by overheating.
Heat dissipation of LED lighting fixtures
In LED lamps, thermal conductive adhesive is used to connect LED chips and aluminum substrates, or the lamp housing and heat dissipation device. Efficient heat conduction can ensure the long-term stable operation of LED lamps under high brightness, extending their service life.
Thermal management of battery modules
In electric vehicle battery modules and energy storage devices, thermal conductive adhesive is used to transfer the heat generated by battery cells to the cooling system, avoiding thermal runaway caused by overheating. Meanwhile, the insulation performance of thermal conductive adhesive can enhance the safety of batteries.
Communication equipment and heat dissipation components
Thermal conductive adhesive is used in communication equipment such as 5G base stations and routers to conduct heat between the heat dissipation module and the motherboard, ensuring the stability of the equipment under high-power and high-frequency working conditions.
Automotive Electronic Systems
Equipment such as automotive electronic control units (ECUs), inverters, radar modules, etc. typically require efficient thermal conductive adhesives for thermal management to adapt to complex usage environments and high temperature conditions.
4、 Precautions for selecting thermal conductive adhesive
Thermal conductivity
Select a thermal conductive adhesive with appropriate thermal conductivity according to the specific heat dissipation requirements of the application scenario. For example, for high heat output equipment, products with higher thermal conductivity should be selected.
Electrical performance
If the application scenario requires insulation, it is recommended to choose a thermal conductive adhesive that has both high thermal conductivity and high insulation performance to ensure equipment safety.
Operational performance
The flowability, curing time, and ease of operation of thermal conductive adhesive during construction should meet actual needs. For automated production lines, it is recommended to choose thermal conductive adhesive with good fluidity and fast curing.
Environmental tolerance
For high temperature, high humidity or strong mechanical vibration environment, heat transfer adhesive with high temperature resistance, aging resistance and seismic resistance shall be selected to ensure long-term reliability.
5、 Future Development Trends
With the increasing trend of miniaturization and high power of electronic devices, higher requirements have been put forward for the thermal conductivity efficiency of thermal conductive adhesives. The future development directions of thermal conductive adhesives include:
Higher thermal conductivity: By developing new filling materials, the thermal conductivity efficiency of the thermal conductive adhesive is improved.
Versatility: develop heat conductive adhesive with high heat conductivity, high temperature resistance and aging resistance to meet diversified needs.
Environmental friendliness: Promote the application of solvent-free thermal conductive adhesives to reduce their impact on the environment.
Thermal conductive adhesive has become an important component of modern industrial heat dissipation technology due to its excellent thermal conductivity. Whether it is electronic components, LED lamps, or new energy batteries, the thermal conductivity efficiency of thermal conductive adhesive directly affects the performance and lifespan of the product. In practical applications, selecting appropriate thermal conductive adhesive and optimizing construction processes can achieve efficient and stable thermal management of equipment.
Tags: Thermal conductivity · Thermal sealing adhesive · Thermal sealing adhesive · Sealing adhesive
