Air Flow Sensor (AFS) is widely used in modern automobiles, industrial equipment, and air purification systems. Its main function is to monitor air flow to ensure efficient operation of the system. In the automotive industry, air flow sensors are used to monitor the intake of air, thereby optimizing fuel combustion efficiency, reducing emissions, and improving engine performance. With the advancement of technology, the performance requirements for air flow sensors are becoming increasingly high, and the protection of PCB (printed circuit board) has become a key factor. In order to cope with the challenges of harsh environments, the PCB of air flow sensors must have good mechanical strength, electrical insulation, waterproofing, and anti-corrosion performance.
Air flow sensor
Air flow sensors face challenges
However, in the design and production process of air flow sensors, PCB protection faces great challenges. Firstly, as sensors are often exposed to high temperatures, humidity, chemical corrosion, and other environments, how to effectively protect electronic components from these external factors is a priority consideration in design. Secondly, due to the fact that air flow sensors typically require a certain amount of mechanical stress, PCB encapsulation materials must be able to effectively alleviate mechanical stress and avoid sensor failure caused by stress concentration. Finally, with the continuous development of electronic technology, the volume of sensors is becoming smaller and smaller, while the performance requirements are becoming higher and higher. This requires potting materials not only to have excellent protective performance, but also to meet the limitations of space and weight.
Explore the encapsulation solution for Yilian current sensors – Yilian Electronic Adhesive Elaplus
Recommended product: SIGEL 1805 additive high elasticity sealing adhesive
In order to address the above challenges, SIGEL 1805, as a 1:1 hybrid additive high elasticity potting adhesive, has become an ideal choice for PCB potting of air flow sensors due to its excellent performance. The following are the main advantages of SIGEL 1805:
SIGEL 1805A/B is a double liquid transparent solid silicon gel gel, which forms a buffer elastic soft material after curing. Used to isolate moisture and other harmful pollutants from contacting circuit boards, and provide insulation for high voltages. Another use is to provide stress relief to protect circuits and interconnects from high temperature and mechanical stress.
Characteristics of Air Flow Sensor PCB Encapsulation Product
▶ 1: 1 additive high elasticity
▶ Excellent softness, eliminating mechanical stress
▶ Extremely low oil permeability after curing, excellent resistance to poisoning
▶ Excellent high-temperature electrical insulation, providing protection against high voltage
▶ Excellent resistance to weathering and weathering
▶ Excellent waterproof, anti-corrosion, moisture-proof, and chemical resistant properties
summary
SIGEL 1805 additive high elasticity sealing adhesive has become an ideal solution for PCB sealing of air flow sensors due to its excellent performance. Through its excellent mechanical stress relief, waterproofing, insulation, and chemical resistance, SIGEL 1805 ensures the stability and reliability of air flow sensors in harsh environments. Whether it is high temperature, humidity, vibration or chemical corrosion, SIGEL 1805 can provide comprehensive protection, enabling air flow sensors to work stably for a long time, meeting the high-performance requirements of sensors in modern automotive, industrial equipment and other application fields.
label: PCB encapsulation, automotive sensor encapsulation, and air flow sensor encapsulation
