AI-Driven Computing Leap: How ELAPLUS Solves 1.6T Optical Module Thermal Challenges with High-Performance TIM Solutions

Driven by the AI and large language model revolution, global data centers are experiencing an unprecedented computing power arms race. As the “capillaries” supporting massive data transmission, high-speed optical communication modules are evolving at an unprecedented pace. As transmission rates advance from 100G to 800G/1.6T, optical module power consumption has surged from 3W to over 15W. With exponentially increasing heat density per unit volume, thermal design is no longer a simple auxiliary feature but a critical technical bottleneck determining module performance, stability and reliability. 01 What Causes Thermal Failure? The “heart” of an optical module is its internal TOSA (Transmitter Optical Sub-Assembly) and ROSA (Receiver Optical Sub-Assembly) components. Chip power consumption grows exponentially with transmission rates: a typical 100G module consumes about 3W, while 800G modules have reached 12-15W, and 1.6T modules are heading toward over 20W. 800G Optical Module Power Consumption: 12~15W 4-5 times that of the 100G era · Thermal management solutions must evolve in tandem In practical applications, thermal failure stems from multiple dimensions. 02 ELAPLUS Thermal Management Solutions Product Categories Model Feature Thermal Gel One-component curable 3100# 250um BLT, 10.2W/m-K，Low Volatility 3380# 250um BLT,8.4W/m-K，Low Volatility 3365# 100um BLT, 6.2W/m-K，Low Volatility 3335# 60um BLT, 3.5W/m-K One-component pre-cured TCMP 80#\100# 250um BLT, 8.5/10.0W/m-K，Low Volatility Two-component curable TCMP 1980# 200um BLT8.5W/m-K, shore 00 30 Thermal Pad GP 60 SF 6.0W/m-K, shore 00 55，Non-silicone Thermal Pad TCMP 130# 13W/m-K, Silicone Thermal Pad In the AI era where computing power defines competitiveness, every iteration of optical communication technology pushes the boundaries of physics. ELAPLUS upholds the brand spirit of “keeping chasing forever,” providing not just materials but comprehensive thermal management system solutions tailored to real-world scenarios for global ICT enterprises. Through continuous materials science innovation, ELAPLUS is empowering partners to break through thermal bottlenecks, enabling every beam of light to connect the future of the intelligent world at lower temperatures and higher efficiency.