Module semiconductor cooling solution | TCMP 3380 thermal conductive gel 8.4W/M · K high thermal conductivity

With the rapid development of high-speed electronic products such as 5G communication, data centers, and optical modules, device power consumption and heat generation have sharply increased, and thermal management has become a key factor restricting product performance. Elion ELAPLUS launched TCMP 3380 high-performance heatable gel, which is specially designed for precision electronic devices such as optical modules and semiconductors, to help engineers easily solve the problem of heat dissipation in narrow spaces. ELAPLUS TCMP 3380One component heat curable silicone thermal conductive gel | Heavy engineering type Thermal conductivity, 8.4 W/m·KMinimum thickness, 250 μmTemperature resistance range, -40℃~+200℃Heavy Industry,Peel off without residueEight core advantages🔥Rapid heat conduction8.4W/m · K high thermal conductivity, fast heat conduction, effectively reducing device temperature🛡️Relieve stressAfter curing, an elastic gasket is formed to eliminate thermal stress and protect precision components🔊vibration and noise reductionElastic material properties effectively absorb vibrations and enhance product reliability💧Moisture resistant and weather resistantCan resist moisture and other harsh environments, without cracking or sagging💪High tensile strengthHigh tensile strength, good toughness, not easy to tear, convenient for construction and rework📏Ultra thin and compressibleCan be lowered to a thickness of 250um, perfectly filling narrow gaps and reducing thermal resistance🔄Heavy IndustryRework and peel off without residue, convenient for maintenance and replacement, reducing production costs🎯Flexible constructionVarious thicknesses and shapes can be formed through dispensing or screen printingProduct Details Thermal conductive gel Thermal conductive gel Typical application areasOptical module: 400G/800G QSFP-DD, OSFP optical module, DSP chip, TOSA/ROSA component heat dissipationSemiconductors: IGBT modules, power devices, integrated circuit heat dissipation5G Communication: Thermal Management of 5G Base Station Optical Modules and Front/Middle Transmission EquipmentData center: Heat dissipation of switches, routers, optical portsAutomotive Electronics: Vehicle mounted optical module, LiDAR, motor controllerIndustrial control: frequency converter, servo drive, PLC controllerWhy choose ELAPLUS?Core advantages of ELAPLUSProfessional R&D: ELAPLUS has a team of senior material engineers, focusing on innovative research…