Silicon gel for pressure sensor potting – high viscosity, high reliability and high protection

In the packaging protection of pressure sensors, the fluidity, viscosity, and stress release ability of the sealing adhesive often determine the long-term stability and reliability of the sensor. Especially in the face of complex environmental conditions (high humidity, high temperature, mechanical vibration), it is particularly important to select a suitable silicon gel. Today, we recommend a high-performance potting material SIGEL 1805 two-component addition molding silicon gel specially designed for pressure sensors, MEMS chips and precision circuit modules. Load cell gel encapsulation Load cell gel encapsulation1、 Product Features Highlights✅ Soft and elastic, excellent cushioningAfter curing, it forms a soft elastic body that can release mechanical stress under thermal cycling and vibration conditions, protecting the chip and leads from damage.✅ Excellent electrical insulation and protection performanceAfter curing, it has extremely low oil leakage and excellent dielectric properties, which can effectively isolate moisture and corrosive media, providing stable insulation protection for high-voltage circuits.✅ Outstanding aging resistance and weather resistanceLong term exposure to high temperature, high humidity, ozone, and ultraviolet environments results in stable performance, making it suitable for outdoor or automotive electronic sensor applications.✅ 1: 1-ratio additive curing systemEasy to mix, no by-products, low shrinkage rate, mild curing process, can be cured at room temperature or by heating, compatible with automatic glue filling production lines.2、 Typical application scenarios🔸 Pressure sensor encapsulation: used for overall protection of silicon-based chips and circuit board areas, preventing moisture intrusion and mechanical stress damage.🔸 Differential pressure/air pressure sensor packaging: Provides flexible buffering in the packaging cavity to ensure measurement sensitivity and long-term stability.🔸 MEMS、 Micro sensor module: provides stress relief and protective barriers for sensitive components.🔸 Automotive electronic module: suitable for high temperature and high humidity working conditions such as wheel speed sensors and intake pressure sensors. Application case of gel potting4、 Analysis of Technical AdvantagesLeak proof design:…