Potting compounds for electronics products
Silicone potting compound Compared with other potting materials, silicone offers premium latitude in operating temperatures ranging from -60 °C to 200 °C with short durations (~30 minutes) up to 260 °C without loss of adhesion. Their low modulus also makes them a premiere choice when encapsulating delicate surface mount components. Applications: Advantages: * For more product information (TDS/MSDS),please contact the business personnel. Epoxy potting compound Epoxy Potting Compounds that cure to a tough, durable finish. Epoxies offer premium ruggedization and are unmatched for their chemical resistance and shock protection and have excellent adhesion and temperature resistance.The ordinary temperature resistance is around 100℃, the temperature resistance of heating and curing is about 150℃, and there are also temperatures above 300℃. Applications: Advantages: Polyurethane potting compound Urethane Potting Compounds Polyurethanes offer superior protection against water ingression for submersion applications and retain elasticity at very low temperatures and can be repaired.Excellent flexibility after curing. Advantages:
