Advantages, disadvantages and differences of different types of potting compounds
Advantages, disadvantages and differences of different types of potting compounds
EP 6225(62a) A/B Heat cured potting compound
Viscosity (25℃, mPa·s) : A: 70,000±20,000 (4#/5rpm); B:45±15 (1#/60rpm); Density (25℃, g/cm3) : A:1.77; B:1.21; Hardness (Shore D, 25℃) : 90±5 (after mixed curing); Thermal conductivity (W/m.k) : 0.7 (after mixed curing);
SIPA 8230 silicone potting resin
Elaplus SIPA 8230 self-adhesive thermal conductivity and flame retardant potting adhesive is a two-component silicone thermal conductivity potting adhesive, with good fluidity after mixing, operation time can be adjusted according to temperature, room temperature can be deeply cured, suitable for various heat and temperature components potting protection, fully in line with the EU ROHS directive and SVHC REACH requirements.
