Case study | Application of Elaplus PCB board enclosure dam sealing

In the field of electronic manufacturing, the reliability of PCB circuit boards directly determines the stability and service life of products. In order to resist moisture, dust, vibration, and chemical corrosion, encapsulation and dam sealing processes have become the core processes to ensure the long-term operation of circuit boards. Today we will share an example of the application of Yilian PCB board dam sealing. Application scenariosThree prevention measures for local potting: special areas of the PCB board need to be protected with a potting thickness of about 5mm. Stress free silicon gel must be used to avoid stress cracking or solder joint damage.Dam enclosure molding: in order to limit the filling area, it is necessary to use paste dam enclosure glue to construct the boundary first. It is required that the material does not collapse, the surface drying speed is fast, and it is compatible with the subsequent silicon gel, without “poisoning”.face challenges The sealing thickness is large, and if the material shrinks or generates stress, it is easy to cause virtual soldering of solder joints and damage to components.Conventional dam sealant is easy to collapse or slow to solidify, affecting the process efficiency, and some materials are incompatible with silicon gel, which may lead to incomplete solidification.The working environment of PCB is complex, and moisture-proof, waterproof, dustproof, and temperature resistant performance are indispensable. product solution