MEMS chip packaging material upgrade: new trend of FSGEL 3200 sensor potting adhesive
In today’s rapidly developing microelectronics technology, MEMS (Micro Electro Mechanical Systems) chips play a crucial role in high-precision fields such as automotive, medical, and industrial control. Due to its precise internal structure and small size, higher requirements are placed on the encapsulation material – not only to provide excellent electrical insulation performance, but also to have excellent flexibility and resistance to environmental stress. MEMS chip packaging At present, commonly used materials in the market, such as 927F from a certain brand, although widely used in the early days, have gradually revealed limitations such as high oil separation, narrow process window, and high price. Therefore, the customer hopes to find a solution that is equivalent in performance, more stable in process, and can completely replace 927F/Recommended product solutionsThe newly launched FSGEL 3200 by ELAPLUS is a one component fluorosilicon gel specially designed for MEMS, sensors and other precision electronic devices, which can stably replace the 927F and achieve dual upgrading in process and performance:MEMS chipPerformance Highlights Excellent flexibility, forming buffer gel after curing, absorbing stress and protecting chip structureWide range of high and low temperature resistance: -60 ℃ to 250 ℃, suitable for harsh working conditionsExcellent electrical insulation performance: dielectric strength of 25 kV/mm, volume resistance of 10 ¹⁵Ω· cmNo oil separation after curing, improving packaging stabilitySingle component design, more efficient dispensing, supports automationResistant to chemical corrosion and moisture erosion, enhancing long-term reliabilityTypical applicationsSuitable for sealing products such as automotive exhaust sensors, urea sensors, fuel tank temperature sensors, connectors, precision MEMS components, etc.In practical verification, FSGEL 3200 performs well, with uniform curing, transparent and bubble free properties, and no performance decline after long-term aging. It can completely replace 927F for mass production.Every packaging substitution is a reconstruction of trust in materials and processes. FSGEL 3200 is not just a substitute, it…
