LED lens bonding application case sharing: Low-temperature curing epoxy adhesive EP 1722 helps to stabilize the packaging of thermal components
1、 Case background: Adhesive difficulties in LED module packagingWith the widespread application of LED backlight modules in fields such as television, displays, car displays, and lighting fixtures, the precise bonding of lenses as key optical components has a huge impact on the overall performance of the lamp. Customer feedback in actual production:The bonding area contains heat sensitive electronic components;Traditional epoxy adhesives require heating and curing, which poses a risk of damaging components;Require the adhesive to have low-temperature curing performance, reliable bonding strength, and long-term stability;Single component products are more conducive to automated dispensing and production line management.2、 Analysis of customer adhesive demandItem requirementsCuring method: single component, low-temperature curing (acceptable at 80-100 ℃)Adhesive materials include various materials such as PC, PMMA, PBT, aluminum substrate, etcConvenient operation suitable for automatic dispensing, requiring moderate fluidityApplication location: LED module lens and bracket/PCB connection positionPackaging stability, moisture resistance, yellowing resistance, low water absorption, and long-term non shedding3、 Recommended product: EP 1722 single component low-temperature curing epoxy adhesiveTo meet the needs of customers for bonding thermal sensitive components, we recommend using Elaplus EP 1722, which has the following core advantages:✅ Low temperature curingEP 1722 can cure at 80-100 ° C for about 30 minutes, effectively protecting temperature sensitive components and avoiding structural and performance damage caused by traditional high-temperature curing.✅ Single component designNo need for mixing, ready to use, adapted to automated production processes, improving yield and reducing waste.✅ High adhesion, suitable for multiple substratesIt has good adhesion to common LED module materials such as plastics (such as PC, PMMA), glass, and aluminum substrates, and excellent aging resistance.✅ Moisture and heat resistance and low water absorption rateEP 1722 has low water absorption properties and can maintain long-term stable packaging even in high humidity and high temperature environments, making it suitable for outdoor lighting or car scenarios.4、…
