Elaplus Case Study，LED Optical Encapsulation Solution
With the continuous expansion of LED technology in lighting, display, and other optical devices, the requirements for optical packaging materials are becoming increasingly high, especially in the manufacturing of high-performance LED light sources and optical modules. The stability, transparency, high temperature resistance, and anti-interference ability of materials have become key standards for measuring material quality. In this regard, Yilian’s SIPA 1840 is a high-purity two-component thermosetting organic silicon material, which perfectly solves these technical problems and has become an indispensable choice for many enterprises in the LED optical encapsulation process. Background: The demand and challenges of optical packagingThe application of optical devices in LED lighting fixtures is becoming increasingly widespread, not only dominating the traditional lighting field, but also playing an important role in multiple fields such as high-definition display, automotive lighting, and industrial applications. These LED optical modules typically require high transparency, excellent thermal stability, resistance to UV aging, and excellent resistance to mechanical shock and vibration. In addition, they also need to have strong resistance to moisture erosion and pollution.However, in various complex application environments, these requirements undoubtedly increase the challenges in the design and manufacturing process. For example, LED modules need to work stably in high temperature and humid environments, and avoid light decay caused by material aging to ensure that they maintain good optical properties during long-term use.Traditional optical packaging materials often have disadvantages such as insufficient transparency, susceptibility to yellowing, poor high-temperature resistance, and precision control is also a major challenge in the manufacturing process. Especially in the production process, if the curing is uneven or the curing time is too long, it may cause bubbles, textures, or uneven surfaces in the packaging layer, affecting the light efficiency and aesthetics of the LED light source. Therefore, when choosing packaging materials, how to ensure that the…
