SIPC 1822 easily solves the adhesion between lamp bead backplate and aluminum shell
A certain LED lighting company is facing difficulties in bonding the back plate of the lamp bead to the aluminum shell: Industry difficultyIn the production process of LED strip lights, the bonding between the back plate of the lamp bead and the aluminum shell often faces three major challenges:✅ Insufficient thermal conductivity of traditional colloids leads to poor heat dissipation✅ Aging of outdoor environment leads to cracking of adhesive layer✅ Short operation time affects production line efficiencyThe customer urgently needs a glue solution with a thermal conductivity of around 1W/m · K, easy to operate in a flowing state, and excellent environmental resistance.Solution: SIPC 1822 single component thermal conductive adhesiveWe recommend: SIPC 1822， Perfectly matching customer needs:✅ Accurate thermal conductivity: thermal conductivity of 0.7 W/m · K, efficient heat dissipation, ensuring stable operation of the lamp beads;✅ Convenient operation: Flowing state gel, 5-10 minutes non stick to hands, suitable for automated dispensing process;✅ Ultra long lifespan: Excellent outdoor aging resistance, with a service life of 20-30 years, anti pollution and anti humidity, and strong weather resistance;✅ Safe and reliable: Excellent electrical insulation performance (anti corona), resistance to extreme temperatures ranging from -60 ℃ to 200 ℃, and zero concern for mechanical stress.
