Adhesive solution for IGBT junction box
Adhesive solution for IGBT junction box
Adhesive solution for semiconductor
As a special electronic encapsulating material, silicon gel is the preferred material for encapsulating IGBT modules because of its unique weather resistance and aging resistance, excellent high and low temperature resistance, good hydrophobicity and electrical insulation properties, as well as the advantages of low internal stress, good impact resistance and strong adhesion.
Adhesive solution for power batteries
Beginor adhesive can meet the returnable sealing process of lithium battery bezel, with good waterproof performance and sealing ability. BMS battery management system positioning protection and excellent thermal conductivity and electrical insulation performance, fully meet the soft pack, and square battery fixing and thermal conductivity requirements.
