Solution for Partial Encapsulation of Contactor Induction Switch
In automotive electronics, home appliance controllers, and intelligent devices, the contactor induction switch is the core induction and triggering unit. Its working environment is often accompanied by moisture, vibration, dust, and cold and hot cycles, which impose strict requirements on the protection of internal circuits. In order to further enhance the stability, durability, and protective performance of products, more and more manufacturers are adopting the “local encapsulation inside the shell” scheme to achieve long-term sealing protection of sensitive circuit boards (PCBs) and sensing areas.Today, we introduce to you a widely used and highly stable fast curing epoxy adhesive in the industry – EP 2005 fast curing epoxy adhesiveIt is particularly suitable for this scenario:✔ PA66+30% fiberglass shell✔ Partial sealing protection✔ Waterproof and moisture-proof✔ Rapid solidification and improved production efficiency1、 Application background: Why does the contactor induction switch need local sealing?Induction switches are responsible for real-time response to external actions, and their internal circuits include components such as coils, capacitors, resistors, PCBs, etc. Once exposed to moisture, dust, or chemical media, it will cause:Trigger malfunctionOutput drift and misoperationDecreased electrical performanceMetal contact oxidationSignificant decline in lifespanTherefore, manufacturers generally adopt local sealing technology to provide:Sealing protectionAvoid water vapor intrusion and improve equipment lifespan.Mechanical protectionAbsorb vibrations and prevent solder joints from cracking.Electrical insulationReduce risks such as short circuits and electrical leakage.Adapt to cold and hot cycling environments-Environmental stress between 40 ℃ and 85 ℃ will not cause material cracking.Choosing the appropriate sealant is crucial among these requirements.2、 EP 2005 Fast Curing Epoxy Adhesive – A Professional Adhesive Suitable for Rapid SealingEP 2005 is a two-component fast curing epoxy adhesive that combines adhesion, sealing, and protection. It is specifically developed for application scenarios that require “fast assembly+high-strength protection”, and is particularly suitable for internal sealing of intelligent automotive induction switches, micro switches, and sensors. Product…
