EP 6688 One-component Epoxy Encapsulant
Product Description: EP 6688 epoxy encapsulant is one component epoxy adhesive cured by heat, designed for general structure adhesive applications.The cured material can provide excellent shear strength, along with impact and heat resistance. It ‘s designed for protection of bare semiconductor devices. BGA, IC memory cards, Chip carriers, Hybrid circuits, Chip-on-board, Multi-chip modules and Pin grid arrays , Automotive applications. Feature: One component ,solvent freeEasy to handlingLow stressNo Halogenlow VOC, low odorHigh shear and impact strengthHigh temperature resistanceExcellent outing agingExcellent electrical insulationGood moisture resistanceExhibits relatively high flow
