EP 1718 Grey Epoxy Structural Encapsulant
Appearance: Gray liquid
Viscosity mPa·s(25°C):10000-15000
EP 6688 One-component Epoxy Encapsulant
Product Description: EP 6688 epoxy encapsulant is one component epoxy adhesive cured by heat, designed for general structure adhesive applications.The cured material can provide excellent shear strength, along with impact and heat resistance. It ‘s designed for protection of bare semiconductor devices. BGA, IC memory cards, Chip carriers, Hybrid circuits, Chip-on-board, Multi-chip modules and Pin grid arrays , Automotive applications. Feature: One component ,solvent freeEasy to handlingLow stressNo Halogenlow VOC, low odorHigh shear and impact strengthHigh temperature resistanceExcellent outing agingExcellent electrical insulationGood moisture resistanceExhibits relatively high flow
EP 6102 5:1 general type epoxy potting compound
This compound can be cured by room temperature, the curing process is low temperature,low shrinkage rate.Solid surface light, not cracking, moisture proof, insulation Feature Application Used for general electronic components filling and sealing of circuit boards.Room temperature can be cured, the curing process is low temperature, low shrinkage rate. Solid surface light, not cracking, moisture proof, insulation. Item Unit Standards Typical Value Color – Visual inspection transparent Viscosity 25℃, mPa·s GB/T 10247-2008 200±50 Tack-free time 25℃, 55%RH,min GB/T13477-2002 20-40 Density 25℃, g/cm3 ASTM D792 0.85±0.05 Tensile Strength MPa GB/T 528-2009 38 Elongation at break % GB/T 528-2009 200 Thermal Conductivity W/m.K GB/T 10297-1998 0.247 T-peel strength， T-Peel N/mm，Sandblasted Iron(1mm), Fe-Fe，170℃ 20min —— 8.31
