EP 6618 Epoxy Adhesive-Low temperature curing Adhesive

Product Description: EP 6618 is a low-temperature curing one-component epoxy adhesive with high adhesion, low water absorption,suitable for bonding a wide range of materials, and good storage stability. Typical application: It is mainly used for LED back light module lens bonding, and camera module CCD/CMOS frame bonding, suitable for the bonding of temperature-sensitive components.