Science Popularization of Thermal Conductive Epoxy Structural Adhesive | Principles, Characteristics, and Engineering Application System Analysis

01 | What is thermal conductive epoxy structural adhesive?Thermally Conductive Epoxy Structural Adhesive is a high-performance adhesive material that uses epoxy resin as the matrix, adds high thermal conductivity fillers, and forms a dense three-dimensional network structure through crosslinking reactions with curing agents. Its material essentially consists of three types of properties: ① Structural StrengthHigh shear strength, high peel strengthAnti impact, anti vibration, anti fatigueDimensional stability for long-term serviceIt can replace traditional mechanical fixing methods such as screwing, riveting, and welding.② Thermal ConductivityThermal conductive fillers (such as Al ₂ O3, BN, AlN) form a continuous thermal conduction chain during the curing process, giving the material significantly higher thermal conductivity than ordinary epoxy.This function is used for heat transfer of heating components and reduction of interface thermal resistance.③ Epoxy system functionality (Chemical&Environmental Stability)The epoxy matrix forms a stable three-dimensional structure through cross-linking and curing, with:Good temperature resistanceExcellent electrical insulation capabilityResistant to media, moisture and heat, and aging performanceMake it suitable for long-term complex environments.02 | Curing mechanism and interface bonding principleThermal conductive epoxy structural adhesives often use two-component A/B formulations.The standard mixing ratio of Yilian EP 2010A/B high thermal conductivity epoxy structural adhesive is 100:50 (weight ratio).The curing mechanism includes:① Epoxy ring opening and crosslinking reactionThe mixed epoxy group and curing agent undergo ring opening polymerization, and the system changes from liquid to gel to solid, finally forming a high modulus three-dimensional cross-linking structure.② Construction of Thermal Conductive NetworkHigh thermal conductivity fillers form a continuous heat transfer chain during the solidification process of the system, enabling the solidified body to effectively transfer heat outward.③ Surface interface chemical bondingEpoxy has high polarity and is compatible with metals, ceramics SMC、 Chemical bonding or polar adsorption is formed between composite materials and other substrates to improve interfacial stability.03 | EP 2010A/B: Representative of Typical…