Solution for Sealing the Collision Sensor Shell and Bonding the Circuit Board

With the widespread adoption of active safety systems in automobiles, crash sensors have become an indispensable key component in the overall vehicle safety system. Collision sensors are usually installed on the front, longitudinal beams, or side structures, with extremely high requirements for signal stability, environmental adaptability, and structural strength. In its internal structure, the sealing of the shell, the bonding and fixation of the circuit board, and the overall sealing protection are directly related to the stability of the sensor in high temperature, vibration, humidity, and impact environments. Therefore, it is crucial to choose appropriate potting adhesive, sealant, and circuit board bonding materials.In response to the typical application requirements of collision sensors, Yilian has launched three high reliability materials:PUR 1680, EP 1710, EP 1798- covering the entire application chain from shell sealing to PCB fixation to overall encapsulation. 01 Core requirements for adhesive used in collision sensorsThe collision sensor has a compact structure and is sensitive to accuracy and response speed, therefore the following material requirements are proposed:Low viscosity: suitable for sealing and flow with small gaps and complex structuresHigh adhesive strength: ensuring a strong bond between the circuit board and the housingLow CTE (coefficient of thermal expansion): Avoiding stress damage caused by temperature changesHigh temperature resistance level: suitable for environments in the engine compartment area of 150 ° C+Excellent thermal conductivity: effectively disperses heat from electronic componentsLong term aging resistance: resistant to moisture, salt spray, vibration, and impactCompliant with vehicle regulations: such as UL94 V-0, H-grade temperature resistance, etcBelow we will introduce the optimal combination of adhesive for different working conditions.02 Recommended products and application scenariosPUR 1680- Lightweight choice for low viscosity potting, shell sealing, and circuit board bondingRecommended applications: PCB bonding, shell sealing, small gap sealing Product Features: Ratio 100:16, low viscosity, excellent flowability, suitable for complex structure…