Elaplus Case Study: Dam Sealing for Circuit Board
Excellent heat dissipation and protection performanceAfter sealing with PUR 1680, the product successfully passed the high-temperature and high humidity test. The circuit board remained stable during long-term operation, and its thermal conductivity met the requirements of light to moderate heat dissipation, avoiding component overheating damage.Yilian has always been committed to providing high-quality and affordable adhesive solutions for the electronic manufacturing industry. We believe that this dam sealing solution can bring convenience and value to more electronic manufacturing enterprises, and we will continue to research and develop more products that meet market demand.If you are interested in our SIPC 1859 and PUR 1680, please feel free to contact us at any time for more technical support and product information. Let Yilian adhesive provide more reliable protection for your products!Tags: Dam enclosure glue · Dam enclosure glue · Circuit board enclosure glue · Circuit board sealing The sealing adhesive has a certain thermal conductivity coefficient: it ensures that the heat of the circuit board can be conducted in a timely manner, reducing the impact of high temperature on the components; Non brushed fence rubber: improves construction efficiency and avoids affecting product appearance or packaging quality due to brushed rubber materials; Affordable price: Control material costs, suitable for mass production.The following is our recommended combination of dam and sealant – dam sealant SIPC 1859 silicone adhesive and sealant PUR 1680 polyurethane sealant, which perform well in terms of performance and cost-effectiveness. Beginor Circuit Board Dam Sealing Solution1、 Dam sealant: SIPC 1859SIPC 1859 is a high-performance single component silicone sealant that is highly suitable for use as dam sealant. Its advantages include: No wire drawing, excellent molding effectIn the process of dam enclosure, wire drawing of adhesive materials can lead to defects in the packaging process, such as uneven colloid and leakage of sealing….
