New choice for precision electronic potting: SIPA 3015 bonded add silicone, born for reliability!
SIPA 3015 Plus-type adhesive sealant for high reliability electronic componentsIn the electronics packaging industry, engineers often face the following dilemmas:✅ Want a good sealing protection, but also worry about the collar and the device between the adhesion is insufficient to lead to the drop;✅ We want to have strong adhesion, and do not want to produce stress damage to sensitive components after curing. Power FillingTo solve this pain point, Elaplus introduced a new generation of adhesive-type additive sealing silicone – SIPA 3015 A/B, this product achieves a balance in sealing protection + structural adhesion + low stress performance, which is widely used in sensors, connectors, transformers, outdoor modules, electronic control boards and other high reliability areas.Core technology breakthrough: filling adhesive can also be strongly bonded!SIPA 3015 uses a modified addition reaction system, so that it can be directly bonded to a variety of substrates such as PC, PBT, PA, PET, epoxy resin, aluminum, copper, etc. without the need for a base coating.Characteristics SIPA 3015 Traditional Molded SiliconeAdhesive Strength ✅ Direct bonding of various materials ❌ Additional coating requiredLiquidity ✅ Low viscosity, suitable for complex structures GeneralStress Control ✅ Extremely low stress after curing, protecting the chip Generally highProcessing Method ✅ Manual or automatic fillingCuring Method ✅ Normal Temperature & Heating Dual Mode Normal Temperature Only✅ Conclusion: SIPA 3015 is the ideal sealing solution for bonding and low stress!✅ Why SIPA 3015?SIPA 3015 is not a “soft adhesive” sealant in the traditional sense, it combines “seal protection” with “structural adhesion” in one, achieving a new breakthrough in the adhesion of multiple substrates without the need for a base coating, especially suitable for the protection of electronic components with limited space but requiring reliability.🚀 Key advantages:1:1 mixing ratio, simple process, suitable for automatic irrigation systemLow viscosity good fluidity, easy to fill small…
