Condensation type electronic potting compound and addition type electronic potting compound

Condensation CureCondensation type electronic sealing adhesive is a type of material that solidifies through condensation reactions, usually formed by reacting silicone rubber or polyurethane resins with curing agents. The curing process usually releases small molecular substances such as water or alcohol. The main characteristics of this type of sealant are as follows: Characteristic* Curing method: The curing reaction of condensation sealant is usually carried out by heating or reacting with a curing agent at room temperature. During the solidification process, colloidal molecules interconnect and release small molecule substances.* Longer curing time: Compared to addition molding sealant, condensation molding sealant usually has a longer curing time, especially in humid environments where the curing rate may be slower.* Applicable environment: Suitable for applications with low curing temperature requirements, such as use under low or normal temperature conditions.* Chemical stability: After curing, it has good chemical stability, heat resistance, and weather resistance, especially strong corrosion resistance in high humidity and acid-base environments.* Disadvantage: During the condensation reaction, volatile substances such as water or alcohols may be released, which may corrode or affect the performance of sensitive electronic components.Typical applications* Silicone potting: For example, used for waterproofing, sealing, and insulation protection of electronic devices, home appliance components, sensors, etc.* Transformers and power equipment: provide excellent insulation performance, high temperature resistance, and corrosion resistance.* LED and lamp packaging: Provides waterproof, moisture-proof, and dustproof functions.Addition Cure for Electronic potting compoundAdditive electronic sealant is cured through addition reactions, such as those of silane, silane, or other monomers. The curing process does not involve the release of small molecules, so the curing reaction is very clean and does not produce volatile by-products. The characteristics of additive electronic sealant are as follows: Characteristics: Typical applications* PCB protection: Provides waterproof, dustproof, and corrosion-resistant protection for sensitive circuit boards, commonly used…