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Integrated adhesive solution for electronic devices

Industrial electronics

Industrial electronics

Industry Application Consumer Electronics

Case study | Application of Elaplus PCB board enclosure dam sealing

In the field of electronic manufacturing, the reliability of PCB circuit boards directly determines the stability and service life of products. In order to resist moisture, dust, vibration, and chemical corrosion, encapsulation and dam sealing processes have become the core processes to ensure the long-term operation of circuit boards. Today we will share an example of the application of Yilian PCB board dam sealing. Application scenariosThree prevention measures for local potting: special areas of the PCB board need to be protected with a potting thickness of about 5mm. Stress free silicon gel must be used to avoid stress cracking or solder joint damage.Dam enclosure molding: in order to limit the filling area, it is necessary to use paste dam enclosure…

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Charging module MOS tube bottom heat dissipation adhesive solution | SIPA 1921 thermal conductive silicone

In the current trend of fast charging, continuous miniaturization and high power of power modules, MOS transistors, as core power devices, often need to withstand high currents, high temperatures, and frequent working impacts. The heating problem of MOS transistors directly affects the efficiency and reliability of the entire charging module. If the heat dissipation is not timely, there may be a risk of excessive temperature rise, device performance degradation, or even failure.Therefore, how to achieve efficient heat dissipation at the bottom of MOS transistors while balancing adhesion and reliability has become a focus of attention for major power supply manufacturers.Background and ChallengesIn practical applications, there are several common solutions for heat dissipation at the bottom of MOS tubes in charging…

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Case study of connector PIN needle gluing | Low viscosity and high reliability, helping high-performance electronic packaging

In the field of electronic manufacturing, the sealing and sealing of connector PIN pins is a key step in ensuring the long-term stability and performance of products. Recently, we solved the challenge for a customer to simultaneously meet the complex requirements of reflow soldering heat resistance, high adhesion, low viscosity and easy sealing of the potting adhesive in a PA6+GF30% shell+PIN needle tin plated structure.Customer ChallengeSpecial structureThe shell is made of PA6+GF30% reinforced nylon, and the surface of the PIN needle is plated with tin, which requires high adhesion of the adhesive and significant differences in thermal expansion coefficients between different materials.Strict process requirementsIt must undergo reflow soldering process, requiring the adhesive to have excellent high-temperature resistance and not bubble,…

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【 Case Study 】 Analysis of Damping Terminal Sealing Process and Adhesive Solution: SIPC 2130 and 1908 Double Adhesive Combination, Excellent Performance!

In the field of precision electronic components, the sealing treatment of damping terminals is a key link to improve product reliability and extend service life. It can not only effectively isolate the erosion of the external environment, but also endow the terminal with excellent mechanical properties. Today, we will delve into a successful case of damping terminal sealing, revealing how to achieve a dual improvement in performance and efficiency through precise adhesive solutions.1、 Project Background: Challenges and Opportunities CoexistThis case focuses on the encapsulation of high-performance damping terminals. Faced with increasingly stringent market demands, our engineering team needs to address a series of technical challenges while ensuring the insulation and durability of electronic connections within the terminals. The core goals…

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PCB dam sealing and potting – guardians of electronic components

In the trend of miniaturization and high integration of modern electronic products, the protection of electronic components has become particularly important. The dam enclosure and sealing process, as important means in the field of electronic protection, provides comprehensive protection for electronic products, effectively improving their reliability and service life. Dam enclosure technology: building a solid defense lineThe enclosure process, as the name suggests, is to form a “dam” around electronic components or circuit boards to restrict the flow range of subsequent sealant. This’ dam ‘is usually formed by colloids with high viscosity, which not only ensures that the sealant evenly covers the target area, but also avoids colloid overflow and contamination of non target areas.The role of dam enclosure technology:Precise…

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New choice for precision electronic potting: SIPA 3015 bonded add silicone, born for reliability!

SIPA 3015 Plus-type adhesive sealant for high reliability electronic componentsIn the electronics packaging industry, engineers often face the following dilemmas:✅ Want a good sealing protection, but also worry about the collar and the device between the adhesion is insufficient to lead to the drop;✅ We want to have strong adhesion, and do not want to produce stress damage to sensitive components after curing. Power FillingTo solve this pain point, Elaplus introduced a new generation of adhesive-type additive sealing silicone – SIPA 3015 A/B, this product achieves a balance in sealing protection + structural adhesion + low stress performance, which is widely used in sensors, connectors, transformers, outdoor modules, electronic control boards and other high reliability areas.Core technology breakthrough: filling adhesive…

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手机胶黏剂应用方案

Mobile Phone/Tablet PC Beginor adhesive application solution

Mobile Phone/Tablet PC Beginor adhesive application solution

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Bonding • Sealing • Thermal conductive

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