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Integrated adhesive solution for electronic devices

Industrial electronics

Industrial electronics

Industry Application Consumer Electronics

How to Choose the Right “Neck Glue” for High-Speed Motors?

Reliable Application Scheme of EP 1738 in Key Parts of High speed MotorsIn the structure of high-speed motors, the “neck position” is a small and critical adhesive point.Not only does it bear high-speed centrifugal force here, but it also has to face multiple working conditions such as high temperature, vibration, and thermal shock for a long time. Once the adhesive layer fails, it may cause abnormal noise and eccentricity, and in severe cases, the magnetic steel may fall off and the entire machine may be scrapped. Neck glue This is also the reason why “motor neck glue” has higher requirements for materials. 1、 What are the mandatory requirements for adhesive in the neck position of the motor?Based on the actual…

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What adhesive is used for sealing three-phase copper busbars?

Analysis of the Application Solution of EP 1721 in High-Reliability Electrical Connection SealingIn new energy vehicles, electric drive systems, industrial motors, and power modules, three-phase copper busbars not only handle high-current transmission tasks but also serve as critical nodes for structural sealing and reliability.Once the seal fails, the ingress of lubricating oil, coolant, or oil vapor can lead to insulation degradation in mild cases, or corrosion, short circuits, and even system failure in severe cases. Therefore, the sealing adhesive for three-phase copper busbars is by no means “just about sticking.”. Three-phase copper busbar sealing ✅ 1. Reliable bonding capability to copper and its coatingsIt exhibits excellent wetting and adhesion on bare copper/brassThe copper busbar with a nickel-plated layer should not…

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Silicone potting compound | Battery cell fixing and potting solution – enhancing battery safety and lifespan

In power batteries, energy storage batteries, and various lithium battery modules, the issue of cell fixation and potting is no longer a matter of “whether there is any”, but rather a matter of choosing what material to use and how to choose it.The appropriate potting material not only determines the structural reliability, but also directly affects the safety, stability, and service life of the battery system. 🔋 Vibration and Shock: Mechanical Stress during Transportation, Running, and Start-Stop Processes 🔥 Thermal Cycling Stress: Repeated Temperature Rise and Drop during Charging and Discharging ⚡ Electrical Safety Risks: Extremely High Insulation Performance Requirements in High-Voltage Environments 🌧️ Environmental Erosion: Long-term Effects of Moisture, Dust, and Condensate Water If the battery cells lack effective…

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SIPA 1830(H50) Vehicle Display Frame Bonding Solution

— Effectively addressing the challenges of debonding and light leakage With the rapid development of smart cockpits, in-vehicle displays are evolving towards larger sizes, narrower frames, and higher brightness. The increasingly sophisticated structure of display modules poses higher demands on frame bonding materials. Once the bonding fails, it can lead to light leakage and abnormal noise at the least, and debonding and reliability failure at the most, directly affecting the overall quality of the vehicle. Common challenges in the display bonding industry: In the bonding of in-vehicle display frames, manufacturers generally face the following issues: The alternating temperature changes cause a significant temperature difference in the interior environment of the degumming vehicle, and ordinary glue is prone to stress concentration…

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Amid the wave of miniaturization of photonic integrated circuits (PICs), encapsulation adhesives are emerging as a key bottleneck for breakthrough

Researchers at Columbia University have recently made a breakthrough in the field of optoelectronics, successfully fabricating the smallest integrated photonic circuit to date and achieving high-performance stable operation over a wide wavelength range for the first time. Researchers liken this achievement to replacing vacuum tubes with semiconductor transistors, with potential impacts significant enough to reshape optical communication and optical signal processing systems. However, as PIC continues to evolve towards smaller sizes, higher integration, and more complex functions, a key aspect that has long been underestimated but determines system reliability is gradually emerging: Packaging and bonding materials for photonic integrated circuits. In actual mass production, the challenges faced by PIC packaging mainly focus on the following aspects: Mode Field Matching (模场匹配)…

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LED adhesive application solution

— From potting to optics, from sealing to thermal conductivity, one set of adhesive solves the reliability issues of LEDs. In LED lighting and display applications, brightness, lifespan, and stability are never determined by a single factor. Temperature rise, moisture, mechanical stress, and optical attenuation are often the key factors determining how long and stably an LED can illuminate. Behind these issues, the selection and matching of adhesives are becoming an indispensable part of LED reliability design. Focusing on the core application scenarios of LEDs, ELAPLUS provides a complete and mature LED adhesive application solution 👇 I. LED encapsulation protection – SIPC 1816 creates a long-term stable “protective layer” for the internal circuit of LEDs. In structures such as LED…

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Bonding • Sealing • Thermal conductive

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