Silicon gel for pressure sensor potting – high viscosity, high reliability and high protection
In the packaging protection of pressure sensors, the fluidity, viscosity, and stress release ability of the sealing adhesive often determine the long-term stability and reliability of the sensor. Especially in the face of complex environmental conditions (high humidity, high temperature, mechanical vibration), it is particularly important to select a suitable silicon gel. Today, we recommend a high-performance potting material SIGEL 1805 two-component addition molding silicon gel specially designed for pressure sensors, MEMS chips and precision circuit modules. Load cell gel encapsulation Load cell gel encapsulation1、 Product Features Highlights✅ Soft and elastic, excellent cushioningAfter curing, it forms a soft elastic body that can release mechanical stress under thermal cycling and vibration conditions, protecting the chip and leads from damage.✅ Excellent electrical…
