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Elaplus SIPA 1822 Two component solid dielectric insulating silicon gel

Elaplus SIPA 1822 Two Component Solid Dielectric Insulating Silicon Gel

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ELAPLUS SIPA 8707 two-component solid silicone potting adhesive (dielectric insulating silicon gel)

Appearance: Transparent
Type: two-component
Application: Used in power semiconductors, electronic sensors, automotive ECU integrated modules and other packaging protection IC chips, undersea fiber pottage and so on.

EP1716A/B 2K Thermal conductive Epoxy potting material

Color: A:Black liquid; B:Light yellow liquid
Viscosity(25°c,m Pa·with): A:40,000+10,000;B:100+50
Appication: tis suitable for packagqing protection of products with hioh themal conductity requirementsinmotors, automotive electonics. oertools reactors.and instrumenis. and has excelent adhesion ai
temperature resistance.

EP 6220 epoxy resin adhesive-Suitable for potting and structural bonding

Product Description: 6220 epoxy adhesive is a room temperature/heat curing resin adhesive. This two-component adhesive is designed for metal bonding, SMC fiberglass parts bonding, aluminum honeycomb panel splicing, motor product iron core bonding, ceramic membrane component sealing, soft magnetic unit potting, high temperature resistant sensor potting, etc. Feature: 1.Resistant to moisture, dirt and other atmospheric components2.High strength, excellent adhesion3.Good anti-pollution, low surface pretreatment requirements4.No solvent, no curing by-products5.Excellent high and low temperature resistance, -50℃-150℃6.Resistant to transformer oil, low attenuation7.Good adhesion to glass fiber cloth and steel plate

EP 6108-5 A/B 2K Transparent Epoxy Encapsulant

Product descriptionEP 6108 series is a two-component solvent-free ambient curable epoxy structural adhesive with low viscosity, high hardness, chemical resistance and mechanical properties. Feature:Low viscosity, good toughnessHigh transparency, no wrinkles on the surfaceExcellent electrical insulation and stabilityGood waterproof and moisture-proofOperating temperature range -40-120 °C

EP 6118 Grey Epoxy Structural Encapsulant

Product descriptionEP 6118 Grey Epoxy Structural Encapsulant is an epoxy adhesive with fast chamber curing speed.This two-component epoxy adhesive is designed to bond ceramics, metals, glass, plastics, rubber, paper, cloth and other products.EP 6118 grey epoxy structural potting adhesive cures without heating. After thoroughlymixing the A and B components with 3:1 (weight ratio or volume ratio), the product has a long operating time of 2 hours, good foaming, and forms a gray hard protective layer after curing. Feature1.Resistant to moisture, dirt and other atmospheric components2.High strength, excellent adhesion3.Good anti-pollution and low surface pretreatment requirements4.No solvents, no curing by-products5.Stable mechanical and electrical properties between -5 0-120°C6.It has good adhesion to plastic PC, glass fiber and steel plate

EP 6112 A/B Potting Compound Material-Flame Retardant Epoxy Resin

Product Description: EP 6112 is a two-component solvent-less, room temperature curing epoxy potting material for automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product package protection, and has excellent adhesion and heat resistance. FEATURES1.Heat curing will bring high heat resistance2. Excellent adhesion, anti-cracking3.Low CTE linear expansion coefficient4. Having a high thermal conductivity5.Excellent electrical insulation, stability6. UL approved，yellow card number is E3401997.Very low water absorption, good waterproof, moisture resistance

EP 6688 One-component Epoxy Encapsulant

Product Description: EP 6688 epoxy encapsulant is one component epoxy adhesive cured by heat, designed for general structure adhesive applications.The cured material can provide excellent shear strength, along with impact and heat resistance. It ‘s designed for protection of bare semiconductor devices. BGA, IC memory cards, Chip carriers, Hybrid circuits, Chip-on-board, Multi-chip modules and Pin grid arrays , Automotive applications. Feature: One component ,solvent freeEasy to handlingLow stressNo Halogenlow VOC, low odorHigh shear and impact strengthHigh temperature resistanceExcellent outing agingExcellent electrical insulationGood moisture resistanceExhibits relatively high flow

EP 6102 5:1 general type epoxy potting compound

This compound can be cured by room temperature, the curing process is low temperature,low shrinkage rate.Solid surface light, not cracking, moisture proof, insulation Feature Application Used for general electronic components filling and sealing of circuit boards.Room temperature can be cured, the curing process is low temperature, low shrinkage rate. Solid surface light, not cracking, moisture proof, insulation. Item Unit Standards Typical Value Color – Visual inspection transparent Viscosity 25℃, mPa·s GB/T 10247-2008 200±50 Tack-free time 25℃, 55%RH,min GB/T13477-2002 20-40 Density 25℃, g/cm3 ASTM D792 0.85±0.05 Tensile Strength MPa GB/T 528-2009 38 Elongation at break % GB/T 528-2009 200 Thermal Conductivity W/m.K GB/T 10297-1998 0.247 T-peel strength， T-Peel N/mm，Sandblasted Iron(1mm), Fe-Fe，170℃ 20min —— 8.31

EP 6113 A/B High temperature resistant two-component epoxy potting material

EP 6113A/B is a two-component solvent-free, room temperature curing epoxy potting material, which is suitable for packaging and protection of products with high thermal conductivity requirements in motors, automotive electronics, power tools, reactors, and meters, and has excellent adhesion and temperature resistance.

EP 6225(62a) A/B Heat cured potting compound

Viscosity (25℃, mPa·s) : A: 70,000±20,000 (4#/5rpm); B:45±15 (1#/60rpm); Density (25℃, g/cm3) : A:1.77; B:1.21; Hardness (Shore D, 25℃) : 90±5 (after mixed curing); Thermal conductivity (W/m.k) : 0.7 (after mixed curing);

SICOAT 921L Conformal Coating for sealing and bonding

Product description: SICOAT 921L is a one-component, none-solvent type conformal coating ,based on silicone.It cures on exposure by moisture to form an elastic silicone rubber film.SICOAT 921L has excellent corrosion-free adhesion to metals, including copper, plastics, ceramics, glass, etc, without the use of primers.Excellent high and low temperature resistance: from–60℃ to 250℃. Stably under working temperature 200 ℃ for long term.Excellent weather ability, water and chemical resistance. FeatureRoom-temperature; resist humidity and other harsh environments;Easily removable;good dielectric properties; self-priming adhesion;Prevent PCB board suffering humid and corrosive.

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Sicoat 9067 Single component silicone conformal coating

Color: Transparent;
Viscosity (25 ℃ mPa · s): 200 ± 50;
Density (25 ℃ g/cm3): 0.85 ± 0.05;

SICOAT 9060-M UV/Moisture dual curable conformal coating

Color: Light yellow liquid;
Density (25 ℃ g/cm3): 1.10 ± 0.05;
Viscosity (25 ° CmPa · s): 190 ± 60;

SICOAT 9060-L UV/Moisture dual curing conformal coating

SICOAT 9060-L is a single component, UV moisture dual cured polyurethane acrylate triple proof adhesive with excellent chemical resistance, moisture resistance, and thermal shock resistance. Rapid curing can be achieved under UV irradiation, and moisture curing can be achieved in shaded areas that are not exposed to UV light.

SICOAT 921 series silicone sealant

SICOAT 921 series silicone coating adhesive is low viscosity neutral organic silicone, solid content is 100%, easy to spray, dip, brush or pour.

SICOAT 9060 UV/Silicone Conformal Coating

SICOAT 9060 is a low viscosity single component silicone resin protective coating, easy to use, after curing to form a layer of optical transparent film, with excellent high and low temperature resistance, weather resistance, electrical insulation properties and excellent waterproof, seismic and absorption expansion and contraction, corona resistance, anti-leakage performance.

Sicoat 9007 Silicone Conformal Coating

SICOAT 9007 is an organic silicone resin conformal coating material used for surface coating of electronic components, suitable for temperatures ranging from -60 to 200 ℃. This product is suitable for coating the surface of PCB circuit boards, which can be insulated, moisture-proof, waterproof and rust proof. The surface is bright and smooth, with high mechanical strength. The paint film is highly transparent, and it has properties such as anti leakage, shock, dust, corrosion, aging, and corona resistance.

SICOAT 921 series organic silicone sealant

SICOAT 921 series silicone coating adhesive is low viscosity neutral organic silicone, solid content is 100%, easy to spray, dip, brush or pour. Protective coatings for hard and soft printed circuit boards and for impregnated porous substrates.

EP 650 single component epoxy structural adhesive

Color: White, blue, purple, or other custom color
Tensile Strength (Mpa) : 38
Application: Hemming and structural bonding in the automotive industry

ELAPLUS EP 1707A/B high temperature resistant two-component epoxy structural adhesive

Color: Component A: Black; Component B: brownish yellow; Colors can be customized;
Viscosity (25 ℃ mPa · s): Component A: 101500 ± 20000; Component B: 32500 ± 10000;
Mixed ratio: 330000 ± 10000;
Density (25 ℃ g/cm3): Component A: 1.28 ± 0.05; Component B: 1.30 ± 0.05;

PUR 5103 A/B structural adhesive

PUR 5103 A/B is a two-component solvent-free room temperature curing adhesive. Low odor, low VOC, compliant with ROHS and REACH regulations.

ELAPLUS PUR 1650 A/B Thermal conductive structural adhesive

PUR 1650 A/B is a two-component solvent-free room temperature curing adhesive. Low odor, low VOC, compliant with ROHS and REACH regulations.

ELAPLUS PUR 1601 A/B Structural adhesive

PUR 1601 A/B is a two-component solvent-free room temperature curing adhesive. Low odor, low VOC, compliant with ROHS and REACH regulations. Wide process operability, high physical properties of the finished product, suitable for machine dispensing and manual mixing operation; After curing, it has good adhesion, strong adhesion, excellent flexibility and elasticity, and good aging resistance and chemical resistance. It is suitable for sealing and bonding of metal, plastic, rubber, polyester and other materials.

EP 1750 Epoxy Adhesive

EP 1750 is a one-component heat-curing paste epoxy based adhesive developed specifically for body workshops. It can bond all grades of automotive steel and aluminum. EP 1750 has low temperature curing in electronic coating ovens, excellent low temperature impact properties, good processability and excellent toughness as an epoxy adhesive at -40°C and high test speeds.

EP 1760High toughness single component epoxy adhesive

EP 1760 is a gray and solvent free single component epoxy structural adhesive,

EP 621 Series single component epoxy adhesive

Elaplus EP 621 series is a single component high-performance epoxy resin structural adhesive developed for the trend of miniaturization, lightweight, and high output in power electrical and electronic equipment.

EP 621 one-component epoxy adhesive

Product Description EP 621 is a black, solvent-free, one-component epoxy structural adhesive. This product has good toughness and impact strength. When it is fully cured by heat, it can provide excellent bonding performance, electrical properties, moisture resistance and mechanical properties. It has high bonding strength to most substrates including glass, metal, ceramics, etc., and can meet the bonding and mechanical performance requirements at high temperatures. It is widely used in automotive electronics, pressure sensors, wiring harnesses, and motor magnetic sheet bonding.

EP 6618 Epoxy Adhesive-Low temperature curing Adhesive

Product Description: EP 6618 is a low-temperature curing one-component epoxy adhesive with high adhesion, low water absorption,suitable for bonding a wide range of materials, and good storage stability. Typical application: It is mainly used for LED back light module lens bonding, and camera module CCD/CMOS frame bonding, suitable for the bonding of temperature-sensitive components.

ELAPLUS EP 1707A/B high temperature resistant two-component epoxy structural adhesive

EP 1750 Epoxy Adhesive

EP 627 single component epoxy structural adhesive

EP 627 is a black, solvent-free, one-component epoxy structural adhesive with excellent toughness and impact strength, providing excellent bonding properties, electrical properties, moisture resistance and mechanical properties when fully cured by heat

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