Thermal Potting& Encapsulation
√ High performance and high thermal conductivity electronic potting
√ Compliant with ROHS directive and SVHC REACH certification
EP 6225(62a) A/B Heat cured potting compound
Viscosity (25℃, mPa·s) : A: 70,000±20,000 (4#/5rpm); B:45±15 (1#/60rpm); Density (25℃, g/cm3) : A:1.77; B:1.21; Hardness (Shore D, 25℃) : 90±5 (after mixed curing); Thermal conductivity (W/m.k) : 0.7 (after mixed curing);
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