Potting material
√ High and low temperature resistance, flame retardant thermal conductivity, and crack resistance
√ Organic silicon potting sealant, polyurethane potting sealant, epoxy potting sealant, acrylic potting sealant
√ High and low temperature resistance, flame retardant thermal conductivity, and crack resistance
√ Organic silicon potting sealant, polyurethane potting sealant, epoxy potting sealant, acrylic potting sealant
Color: A:Black liquid; B:Light yellow liquid
Viscosity(25°c,m Pa·with): A:40,000+10,000;B:100+50
Appication: tis suitable for packagqing protection of products with hioh themal conductity requirementsinmotors, automotive electonics. oertools reactors.and instrumenis. and has excelent adhesion ai
temperature resistance.
Product Description: SIPA 8230(7#) A/B is a two-component low-density silicone potting adhesive. It has good fluidity after mixing. The operation time can be adjusted according to the temperature. It can be deeply cured at room temperature. It is suitable for potting protection of various heat dissipation and temperature-resistant components. It fully complies with the EU ROHS directive and SVHC REACH requirements. Feature
MoreProduct Description: 6220 epoxy adhesive is a room temperature/heat curing resin adhesive. This two-component adhesive is designed for metal bonding, SMC fiberglass parts bonding, aluminum honeycomb panel splicing, motor product iron core bonding, ceramic membrane component sealing, soft magnetic unit potting, high temperature resistant sensor potting, etc. Feature: 1.Resistant to moisture, dirt and other atmospheric components2.High strength, excellent adhesion3.Good anti-pollution, low surface pretreatment requirements4.No solvent, no curing by-products5.Excellent high and low temperature resistance, -50℃-150℃6.Resistant to transformer oil, low attenuation7.Good adhesion to glass fiber cloth and steel plate
MoreProduct Description: SIPC 8125 A/B is a normally popular potting material. It supplies stable protection to variety of electric components.The mixture is flowable, would be deeply cured. Theoperation time can be adjusted according to the temperature and agent added.The majority of materials have a good bonding effect without primer, suitable for accessories fixed and waterproof, dust and leakage. Feature: 1)Two-component, condensation de-alcohol type2)Low viscosity, easy processing3)Low hardening shrinkage, no corrosion without stress4)Excellent high temperature electrical insulation, stability set5)Excellent adhesion, good waterproof, moisture resistance Applications:1)Automotive electronics, modules2)Power control module3)Solar module junction box4)LED spotlights, wall washer, bar lights, LED lamps
MoreProduct descriptionEP 6108 series is a two-component solvent-free ambient curable epoxy structural adhesive with low viscosity, high hardness, chemical resistance and mechanical properties. Feature:Low viscosity, good toughnessHigh transparency, no wrinkles on the surfaceExcellent electrical insulation and stabilityGood waterproof and moisture-proofOperating temperature range -40-120 °C
MoreProduct descriptionEP 6118 Grey Epoxy Structural Encapsulant is an epoxy adhesive with fast chamber curing speed.This two-component epoxy adhesive is designed to bond ceramics, metals, glass, plastics, rubber, paper, cloth and other products.EP 6118 grey epoxy structural potting adhesive cures without heating. After thoroughlymixing the A and B components with 3:1 (weight ratio or volume ratio), the product has a long operating time of 2 hours, good foaming, and forms a gray hard protective layer after curing. Feature1.Resistant to moisture, dirt and other atmospheric components2.High strength, excellent adhesion3.Good anti-pollution and low surface pretreatment requirements4.No solvents, no curing by-products5.Stable mechanical and electrical properties between -5 0-120°C6.It has good adhesion to plastic PC, glass fiber and steel plate
MoreProduct Description: EP 6112 is a two-component solvent-less, room temperature curing epoxy potting material for automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product package protection, and has excellent adhesion and heat resistance. FEATURES1.Heat curing will bring high heat resistance2. Excellent adhesion, anti-cracking3.Low CTE linear expansion coefficient4. Having a high thermal conductivity5.Excellent electrical insulation, stability6. UL approved,yellow card number is E3401997.Very low water absorption, good waterproof, moisture resistance
MoreProduct Description: EP 6688 epoxy encapsulant is one component epoxy adhesive cured by heat, designed for general structure adhesive applications.The cured material can provide excellent shear strength, along with impact and heat resistance. It ‘s designed for protection of bare semiconductor devices. BGA, IC memory cards, Chip carriers, Hybrid circuits, Chip-on-board, Multi-chip modules and Pin grid arrays , Automotive applications. Feature: One component ,solvent freeEasy to handlingLow stressNo Halogenlow VOC, low odorHigh shear and impact strengthHigh temperature resistanceExcellent outing agingExcellent electrical insulationGood moisture resistanceExhibits relatively high flow
MoreELAPLUS PUR 660X(6020) is two-component solvent-free potting resin. It cures in room temperature or heating temperature. It’s using for electronics sealing, potting, flame resistant etc. The raw material does not contain heavy metal, it’s environmental with widely operability, high physical properties of the finished product, good adhesion with substrates. It can be deep cured, less heat release when curing, low shrinkage rate. Excellent flexibility after curing with flame retardant efficiency. Key Features1.Excellent low temperature and weather resistance properties.2.Excellent flame retardant efficiency UL 94 V-03.Excellent electrical insulation4.Good waterproof, moisture resistance, very low water absorption5.Good adhesion to almost metal and plastic. Typical Applications
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