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Adhesive Knowledge

What is the reason why the motor sealant becomes soft after fully curing?

2025-03-14

The phenomenon of “softening” of motor sealant after complete curing is one of the common process and product problems in the electronics and motor industries. This abnormal phenomenon may directly affect the fixing and protective effect of internal components of the motor, thereby affecting the lifespan and performance of the motor. So, the reasons for the “softening” of the sealant after complete curing are complex, usually involving multiple aspects such as raw materials, process operations, curing conditions, design selection, etc. Below, Yi Lian will provide a detailed analysis of its causes from multiple perspectives. 1、 Common reasons for the softening of sealant after complete curing

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Deep Analysis of CIPG and FIPG: Definition, Differences, and Applications

2025-03-14

In industries such as electronics, electrical appliances, automobiles, and new energy, sealing technology plays a crucial role in waterproofing, dustproof, anti-corrosion, and extending service life. Among them, CIPG (Cured In Place Gasket) and FIPG (Formed In Place Gasket) are two advanced sealing technologies widely used due to their excellent sealing performance, high degree of automation, and ability to adapt to complex structures. But many people still have a vague understanding of the concepts, differences, and application scenarios of CIPG and FIPG. This article will provide a systematic and in-depth analysis of CIPG and FIPG, assisting engineers and buyers in accurately selecting suitable sealing solutions.Sealing process of battery casing 1、 Definition and working principle of CIPG and FIPG

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The Application of Electronic Adhesives in Electronics: Understanding the “Invisible Heroes” Behind Electronic Manufacturing in One Article

2025-03-14

In the world of electronic products, chips, circuit boards, sensors, etc. are undoubtedly the protagonists, but there is a type of “invisible hero” that silently supports the performance and lifespan of electronic devices – that is, electronic adhesives. Today, Yilian will talk about the types, functions, application scenarios, and future trends of electronic adhesives.1、 What is electronic adhesive?Electronic adhesive is a type of adhesive specifically designed for electronic components, used for bonding, fixing, sealing, conducting electricity, conducting heat, etc. It is a chemical material that can provide mechanical support, protection, and special functions such as conductivity, insulation, and heat dissipation. Compared with ordinary glue, electronic adhesive has higher insulation, heat resistance, aging resistance and environmental adaptability, and is one of the key materials to ensure the long-term stable operation of electronic products.2、 The main function of electronic adhesiveAdhesive fixation: Fixing chips, capacitors, inductors, modules and other components to prevent displacement or damage caused by vibration or impact.Thermal conduction and heat dissipation: dissipate the heat generated during the operation of components to avoid local overheating and extend their lifespan.Electrical performance guarantee: including insulation, conductivity, meeting different functional requirements, such as conductive adhesive, insulating adhesive, etc.Sealed protection: Waterproof, dustproof, and chemically resistant, protecting precision electronic components from stable operation in harsh environments.Stress release: Reduce internal stress caused by thermal expansion and contraction, avoid solder joint cracking and circuit board deformation.3、 The main types of electronic adhesives

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Characteristics and Applications of Thermal Conductive Potting Compound

2025-03-14

With the rapid development and miniaturization trend of modern electronic products, the heat dissipation requirements for electronic components are constantly increasing. How to effectively manage the heat generated by electronic devices and ensure the stability and lifespan of products has become an important issue faced by engineers. Thermal conductive potting adhesive, as a material that combines thermal conductivity and packaging protection functions, has been widely used in LED packaging, power electronics, automotive electronics, communication equipment and other fields in recent years. This article will provide a detailed analysis of the principle, material composition, performance characteristics, application fields, and future development trends of thermal conductive sealant, providing valuable references for industry professionals and related researchers.1、 Basic concept of thermal conductive sealantThermal conductive sealant is a high-performance material specifically used for packaging electronic components. Its main function is to utilize the synergistic effect of high thermal conductivity fillers (such as alumina, silicon nitride, metal powder, etc.) and polymer matrices (such as epoxy resin, silicone, etc.) to achieve fast and efficient heat conduction while ensuring electrical insulation. Compared to traditional packaging adhesives, thermal conductive potting adhesives not only effectively dissipate heat, but also have excellent characteristics such as earthquake resistance, moisture resistance, and chemical corrosion resistance, making them an important guarantee for thermal management of electronic products.2、 The main composition and process of thermal conductive sealant

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Application Solution of ELAPLUS Thermal Conductive Material in Data Centers

2025-02-20

The data center is crowded with intensive servers running resource intensive processes, facing significant challenges related to heat. Overheating can limit server performance to prevent hardware damage, resulting in efficiency losses, while prolonged overheating can accelerate wear and tear, increase hardware failures, and increase the risk of costly downtime. These issues highlight the urgent need for advanced thermal management solutions to ensure optimal performance, reliability, and sustainability of high-performance data centers. In this article, let’s learn how to transform thermal management using advanced data center TIM solutions. Traditional solutions such as phase change films will deteriorate after repeated insertion and removal, such as the solution required for pluggable optical modules (POM). This degradation not only reduces thermal performance, but may also introduce volatile compounds into the data center environment, thereby damaging sensitive electronic components.In addition, these traditional methods often cannot handle the increased power density of newer transceiver designs, and the power density of each module may exceed 20W or even 35W. Due to each line card having up to 32 modules, accumulating thermal load becomes a key challenge. These inefficiencies can lead to overheating, increased energy consumption, and increased cooling costs, ultimately affecting the performance and sustainability of data centers.Given these realities, a top switch manufacturer is seeking a new innovative thermal control solution to reduce the operating temperature of its 20W transceiver application.Why effective thermal conductive material (TIM) solutions are crucial for data centersTIM plays a crucial role in bridging the small air gap between heating components and cooling solutions such as radiators or heat diffusers. If there is no effective TIM, these air gaps will become thermal barriers, reducing heat transfer efficiency and leading to various problems. The TIM solution for data centers ensures the following advantages:Avoiding performance degradation: Overheating can cause the processor and other components…

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Condensation type electronic potting compound and addition type electronic potting compound

2025-02-18

Condensation CureCondensation type electronic sealing adhesive is a type of material that solidifies through condensation reactions, usually formed by reacting silicone rubber or polyurethane resins with curing agents. The curing process usually releases small molecular substances such as water or alcohol. The main characteristics of this type of sealant are as follows: Characteristic* Curing method: The curing reaction of condensation sealant is usually carried out by heating or reacting with a curing agent at room temperature. During the solidification process, colloidal molecules interconnect and release small molecule substances.* Longer curing time: Compared to addition molding sealant, condensation molding sealant usually has a longer curing time, especially in humid environments where the curing rate may be slower.* Applicable environment: Suitable for applications with low curing temperature requirements, such as use under low or normal temperature conditions.* Chemical stability: After curing, it has good chemical stability, heat resistance, and weather resistance, especially strong corrosion resistance in high humidity and acid-base environments.* Disadvantage: During the condensation reaction, volatile substances such as water or alcohols may be released, which may corrode or affect the performance of sensitive electronic components.Typical applications* Silicone potting: For example, used for waterproofing, sealing, and insulation protection of electronic devices, home appliance components, sensors, etc.* Transformers and power equipment: provide excellent insulation performance, high temperature resistance, and corrosion resistance.* LED and lamp packaging: Provides waterproof, moisture-proof, and dustproof functions.Addition Cure for Electronic potting compoundAdditive electronic sealant is cured through addition reactions, such as those of silane, silane, or other monomers. The curing process does not involve the release of small molecules, so the curing reaction is very clean and does not produce volatile by-products. The characteristics of additive electronic sealant are as follows: Characteristics: Typical applications* PCB protection: Provides waterproof, dustproof, and corrosion-resistant protection for sensitive circuit boards, commonly used…

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Elaplus elaborates on the causes and prevention methods of adhesive bubble formation

2025-02-12

The appearance of bubbles during the manufacturing process is a common and challenging issue in adhesive applications. Although these bubbles may seem insignificant, their impact on adhesive strength, reliability, and appearance quality can be profound. Understanding the causes and potential impacts of bubble formation, as well as how to prevent or reduce their occurrence, is key to ensuring the success of adhesive applications.The consequences of adhesive bubblesBubbles are not just visual defects, they may form gaps structurally, significantly reducing the load-bearing capacity of joints and weakening adhesive strength, especially in fields such as aerospace or medical equipment that require high safety. Bubbles can concentrate stress under mechanical loads or temperature changes, making joints more prone to failure.In certain industries, especially those that require precise proportioning of resins and curing agents, the presence of bubbles is more severe. Residual air can interfere with chemical reactions, leading to incomplete curing and subsequently reducing adhesive strength. This situation not only affects functionality, but may also cause serious problems in appearance, especially in applications with high transparency or decorative requirements, where bubbles can significantly reduce the aesthetic appeal of the product.In addition, the presence of bubbles will occupy the space of the adhesive, reduce its coverage, lead to uneven bonding, and thus affect the airtightness or water tightness, resulting in a decrease in sealing performance and ultimately increasing production costs. Defects caused by bubbles may require rework or replacement, and additional quality control measures may be taken, which not only consumes time and cost, but also affects the durability and functionality of the product. Therefore, preventing bubbles is crucial for ensuring the quality and performance of the product.Adhesive bubbles. Reasons for bubble formationUnderstanding the mechanism of bubble formation is the first step in solving problems. Common sources of bubbles include the following:The interaction between…

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Comprehensive understanding of electric vehicle sensors and Elaplus adhesive application solutions

2025-02-12

What is an EV sensor?A、 Understand automotive sensorsAutomotive sensors are one of the essential components of advanced automobiles. It is an electronic system that can monitor various parameters (temperature, coolant system, etc.), faults, and obstacles, issue warnings to the driver, and send signals to the ECU (Electronic Control Unit) for appropriate adjustments.B、 What are the sensors in electric vehicles?In the coming year, with the advancement of technology, the popularity of electric vehicles (EVs) will continue to accelerate rapidly. According to the International Energy Agency, global electric vehicle sales exceeded 10 million units in 2022. It is undeniable that electric vehicles support us in moving towards a more sustainable lifestyle and reducing carbon emissions. Like traditional cars, electric vehicle sensors are also key components for controlling electric vehicle systems, ensuring safety and performance. However, as the energy source of electric vehicles comes from the battery system, the sensors of electric vehicles also change accordingly. Position sensor Current sensor Voltage sensor Temperature sensor Assisted autonomous driving sensor Collect mechanical motion data of traction motors to ensure coordinated operation of the system. After recording the angular position data, the motor controller or motor control unit (MCU) converts it into electrical pulses to initiate the feedback loop Measure voltage in multiple ways, from measuring high voltage to detecting low current levels, to ensure that the insulation of the battery pack and each battery is not damaged.  Temperature sensors are of great significance in electric vehicles, ensuring passengers are safer and more comfortable throughout their journey. Elaplus is committed to researching and improving overall solutions specifically for temperature sensors in electric vehicles In the battery system, it is directly installed in the battery cells, providing accurate temperature measurement and adjusting the heating and cooling processes to ensure that each battery cell operates within a safe…

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Application of Thermal Conductive Adhesive in Electronic Products: Key Materials for Improving Heat Dissipation Performance

2025-01-17

With the rapid development of technology, the functions of electronic products are constantly upgrading, and the performance requirements are becoming increasingly high. Whether it is smartphones, computers, tablets, or consumer electronics products such as televisions and LED lights, heat dissipation has become an important challenge in the design and manufacturing process. In order to effectively solve this problem, thermal conductive adhesive, as an advanced heat dissipation material, is increasingly being applied in various electronic products. Future Trends: Innovation and Development of Thermal Conductive AdhesiveWith the continuous advancement of electronic technology, the application fields of thermal conductive adhesives will also continue to expand. Especially in fields such as 5G communication, high-performance computing, and artificial intelligence, the demand for thermal conductive adhesives will become more urgent. The future thermal conductive adhesive not only requires higher thermal conductivity, but also meets higher environmental standards, more complex application environments, and longer service life.For example, with the rise of smart wearable devices and new energy vehicles, thermal conductive adhesives will take on more heat dissipation tasks, especially in the heat dissipation management of key components such as batteries and motors. The application of thermal conductive adhesives will become increasingly important.Thermal conductive adhesive, as an important heat dissipation material, has broad application prospects in electronic products. The application of thermal conductive adhesive can effectively improve the performance and reliability of products, whether in smartphones, LED lighting, computers, or emerging fields such as 5G communication and electric vehicles. With the continuous advancement of technology, the types, properties, and applications of thermal conductive adhesives will become more diverse, becoming an indispensable key material for future electronic products.Label: Application of thermal conductive gel, thermal conductive adhesive and thermal conductive adhesive in electronic products Basic concept of thermal conductive adhesiveThermal conductive adhesive, as the name suggests, is a type of…

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