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Adhesive Knowledge

The multifunctionality of single component epoxy adhesives: applications, advantages, and key considerations

2025-05-15

In modern manufacturing, adhesives are no longer just adhesive materials, but also one of the core processes for improving product reliability, durability, and protective performance. Especially in high-precision industries such as electronics, electrical, automotive, and new energy, higher requirements have been put forward for the performance of adhesives. Single component epoxy adhesive is a pre mixed epoxy resin system that does not require manual mixing and can be quickly cured by heating. It is suitable for various industrial applications such as automated production, precision manufacturing, electronic packaging, and structural bonding. 1、 What is a single component epoxy adhesive? One component epoxy adhesive is a pre mixed epoxy resin system at the factory, which does not require secondary mixing by the user and can be used directly. It is usually cured by heating. This type of adhesive is stable when stored at room temperature for a long time, and only reacts quickly at a certain temperature to form a high-strength structure. Compared with traditional two-component adhesives, single component products greatly simplify the operation process, avoid human proportioning errors, and improve production efficiency, especially suitable for automated dispensing, sealing, or coating systems. 2、 The core advantages of single component epoxy adhesive ✅ 1. Convenient operation and efficient production No need for weighing and mixing, ready to use, greatly reducing the operating threshold and working time, especially suitable for assembly line operations and automation equipment, can significantly improve unit production capacity. ✅ 2. Fast curing, adjustable control Most products are cured by heating (such as 80 ℃/30 minutes or 120 ℃/10 minutes), and the curing window can be flexibly set according to the actual production cycle, supporting efficient batch processing. ✅ 3. Strong adhesion and wide applicability Epoxy system has excellent polarity and excellent adhesion to various substrates such as metals, ceramics, glass,…

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What is the difference between sealant and hot melt adhesive? Understand clearly in one minute!

2025-05-15

In manufacturing industries such as electronics, automotive, and home appliances, potting adhesive and hot melt adhesive are often used for sealing, fixing, insulation, and other processes. But many people are not clear about the difference between these two types of glue. Today, Elaplus will explain their definitions, application scenarios, advantages and disadvantages, and selection suggestions in one go 👇 🔍 What is sealant?Potting compound is a liquid two-component or single component adhesive that can flow and completely encapsulate electronic components. After curing, it forms an elastic or rigid body with properties such as waterproof, moisture-proof, high and low temperature resistance, insulation, and chemical corrosion resistance.📌 Typical applications:LED driver power supply encapsulationTransformer, power module, sensor packagingAutomotive Electronic Control Module (ECU) Packaging🔥 What is hot melt adhesive?Hot melt adhesive is a thermoplastic adhesive that melts after heating and quickly solidifies after cooling. It is usually in the form of solid rods or particles and is commonly used in automated dispensing or spraying equipment.📌 Typical applications:Packaging industry sealingFurniture edgingQuick bonding of plastic parts for household appliances📊 Potting compound vs hot melt adhesive: key differences at a glanceItem                                                     potting compound                                                   hot melt adhesivePhysical state                                    liquid, needs to solidify solid                                  heated and melted for useCuring method:                                chemical reaction…

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Silicon gel: ideal choice for electronic packaging and protection

2025-05-12

With the continuous improvement of high integration, lightweight, and high reliability requirements for electronic products, traditional packaging and protective materials are no longer able to meet their demanding performance requirements. Among many materials, silicone gel, with its excellent flexibility, electrical insulation, thermal stability and weather resistance, has become a popular packaging and potting material in many fields such as electronics, automobile, new energy, medical treatment, etc. In this paper, Yili’an will comprehensively analyze the application value of silicone gel from the aspects of product definition, performance advantages, application fields, use methods and selection suggestions.1, What is silicone gel?Organo silicon gel is a kind of polymer material based on polysiloxane structure, which is usually supplied in the form of A/B two-component liquid. After mixing, it is cured at room temperature or heating to form a soft elastic gel. Its hardness is much lower than that of ordinary silicone rubber, and it feels like jelly. It has excellent flexibility and resilience, which can effectively cushion external impact and maintain stable performance for a long time.Typical products such as ELAPLUS SIGEL 1806, ELAPLUS SIGEL 8605, ELAPLUS SIGEL 3006, etc. have good transparency, low stress, high insulation, and are suitable for protective packaging of various precision electronics.2, Performance advantages of organosilicon gel

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Detailed explanation of the differences between UV sealant and epoxy sealant: performance comparison, application areas, and selection guidelines

2025-05-08

Potting adhesive is widely used in electronic manufacturing and industrial packaging to protect circuits, improve weather resistance, and extend product life. With the continuous improvement of process requirements, UV sealant and epoxy sealant have become the two most common choices in the industry due to their different curing mechanisms and performance characteristics. So what are the differences between them? This article comprehensively analyzes the curing principle, physical properties, applicable scenarios, advantages and disadvantages of Yilian from multiple dimensions. UV sealant and epoxy sealant 1、 What is UV sealant?UV sealant is a type of UV curable adhesive, usually a single component system, that can be quickly cured by UV irradiation. Suitable for application scenarios that require high efficiency, dense components, and transparency or partial transparency. UV sealing adhesiveCore features:✅ Rapid curing: curing can be completed within a few seconds to minutes under UV irradiation;✅ Good transparency: commonly used in LED packaging and optical sensors;✅ Easy to operate: single component system, no mixing required, suitable for automated dispensing;✅ Suitable for micro precision packaging: low viscosity, strong fluidity, suitable for filling small gaps;⚠️ Attention: UV glue must be transparent to cure, and shadow areas cannot be completely cured. It is necessary to use a photoinitiator or adopt a dual curing system (UV+heat curing).2、 What is epoxy sealant?Epoxy sealant is mainly a two-component thermosetting adhesive (there are also some single component thermosetting types), which is cured through chemical reactions at room temperature or under heating conditions. It occupies an important position in industrial applications due to its excellent mechanical properties and chemical stability. Epoxy sealantCore features:✅ Superior mechanical properties: After curing, it forms a hard material with impact resistance and compressive strength;✅ Strong ability to withstand high and low temperatures: able to withstand -40 ℃~150 ℃ for a long time, suitable for industries such…

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Epoxy sealant: an ideal choice for electronic packaging protection

2025-05-08

In the field of modern electronic manufacturing, epoxy sealant has become the preferred material for electrical insulation, mechanical protection, and environmental sealing. Whether it’s power modules, automotive electronics, LED drivers, transformers, or sensors, epoxy potting adhesive provides reliable and long-lasting packaging solutions with its excellent performance. Epoxy sealantWhat is epoxy sealant?Epoxy potting adhesive is a two-component or one component adhesive based on epoxy resin, commonly used for potting protection of electronic devices. Its characteristics are high adhesive strength, strong thermosetting, low shrinkage rate, and the formation of a dense and hard protective layer after curing. It can effectively prevent water, dust, and corrosion, and has excellent electrical insulation performance.The core advantages of epoxy sealantExcellent electrical insulation performancePrevent current leakage and breakdown, and protect the stable operation of components in high voltage environments.Excellent weather resistance and heat resistanceCapable of withstanding temperature fluctuations ranging from -40 ° C to 150 ° C, suitable for outdoor and high-temperature work environments.High adhesion forceIt can firmly adhere to the surfaces of various materials such as metal, plastic, glass, ceramics, etc., enhancing the overall structural strength.Strong seismic and impact resistance performanceAfter curing, it forms a tough structure that effectively absorbs external stress and prevents component detachment or damage.Good flame retardancyMultiple products have achieved UL 94V-0 flame retardant rating, meeting electrical safety regulations.Application fields of epoxy sealantEpoxy sealant is widely used in the following industries and products:Power module and adapter: improve voltage and moisture resistance levelsLED driver power supply: prevents electrical breakdown and extends service lifeAutomotive electronics (such as sensors, control modules): heat-resistant and earthquake resistant, ensuring driving safetyTransformers and Inductive Components: Improving Insulation and Reducing NoiseNew energy battery pack: Enhance packaging strength to prevent internal short circuitsTypical recommendation: ELAPLUS epoxy sealant EP 1712EP 1712 is a two-component epoxy potting material with the following characteristics:Good toughness and…

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Why does UV glue turn yellow and how to prevent it?

2025-04-25

Transparent UV glue is essential in various industries, from electronic manufacturing to medical applications, due to its fast curing and long-lasting bonding properties. However, over time, the application of UV glue may experience discoloration, where the cured glue turns yellow. This phenomenon will seriously affect the functional performance and aesthetics of the product. So, why does UV glue turn yellow? How to effectively solve this problem? Now let’s explore the key factors that cause UV glue to turn yellow with Yi Lian, and find ways to alleviate and prevent it! Why UV glue turns yellow and how to prevent itThe yellowing phenomenon of UV glue refers to the gradual discoloration of the originally transparent UV glue due to various factors during use. Here are some of the main reasons for UV glue yellowing:Degradation of UV stabilizers: In order to protect UV adhesives from the effects of ultraviolet (UV) radiation, many manufacturers add UV stabilizers to adhesive formulations. However, prolonged exposure to ultraviolet radiation can lead to the degradation of these stabilizers, reducing their protective effectiveness. Eventually, the adhesive will start to turn yellow and lose its original transparency.Oxidation reaction: Components in UV adhesives, such as resins and additives, are prone to oxidation when exposed to light and oxygen in the air. Oxidation produces peroxide structures and free radicals, leading to discoloration of transparent materials. Oxygen is particularly destructive to materials containing unsaturated double bonds or easily oxidizable functional groups. At high temperatures, oxidation reactions accelerate, and even stable single bonds like C-C can break, leading to yellowing. Long term exposure to strong light or high temperature will further intensify oxidation, making yellowing more severe.Exposure to light and high temperatures: When UV adhesives are directly exposed to sunlight or strong artificial light for a long time, the ultraviolet rays in the…

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Elaplus Science Popularization:Why do Electronic Products Need Thermal Management?

2025-04-18

Up to 55% of electronic product failures are caused by heat Most electronic products, such as power transistors, CPUs, and power diodes, generate a significant amount of heat, which may need to be considered in order to extend their lifespan and improve reliability.During operation, the temperature of electronic components will rise until the heat generated inside the device equals the heat dissipated to the surrounding environment, and the device reaches equilibrium. The temperature may be high enough to significantly shorten the shelf life of components and even cause equipment failure.The result of temperature rise will affect the operation of active and passive components in integrated circuits. If the temperature rises high enough, the heated active or passive components may not function properly or even fail completely. This type of failure includes thermal runaway, junction failure, metallization failure, corrosion, resistance drift, and electromigration diffusion. Therefore, minimizing temperature rise in electronic packaging is crucial.What causes the temperature of electronic packaging to rise? Improve power density and currentThe insatiable demand for higher performance processors has led to a steady increase in power consumption in all segmented markets, such as mobile and high-performance desktops, as well as servers and workstations. The increasing power density and current levels in microprocessors have always been the main heat sources, causing concerns about thermal management of on-chip hotspots, packaging, and interconnect Joule heating.PCB surface component density is higherAnother reason why thermal management of electronic circuit boards has attracted attention is that the electronics industry is witnessing a trend of handheld devices and household appliances becoming thinner and smaller. That’s why PCBs are becoming more compact, and the space between components on electronic PCBs is getting closer, making it harder to transfer heat from PCB components.So what if the radiator is not enough?Maximizing the contact area between the radiator…

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Thermal conductive adhesive suitable for electronic and semiconductor applications

2025-04-18

Efficient thermal management is crucial in electronic and semiconductor manufacturing, as overheating can affect performance and lifespan. Thermal conductive adhesive (TCA) can simultaneously bond components and dissipate heat, providing a disruptive solution without the need for additional mechanical fastening, making it an ideal choice for modern electronic applications.Related article: Frequently Asked Questions about Thermal Conductive Adhesive – Elaplus Electronic Adhesive What is Thermal Conductive Adhesive (TCA)?Thermal conductive adhesive (TCA) is a specialized adhesive that contains thermal conductive fillers (such as alumina, boron nitride, or silver particles) suspended in a polymer matrix in its formula. This type of adhesive has a dual function:Strong adhesion between electronic components.Efficient heat dissipation to prevent overheating.Unlike thermal grease or thermal paste, TCA forms a strong and stable adhesive after curing, and can remain durable for a long time, making it an ideal choice for high-performance electronic applications.The main advantages of thermal conductive adhesiveSimplified assembly process: Unlike thermal paste that requires additional mechanical fastening, TCA can simultaneously bond and dissipate heat, simplifying the assembly process and reducing manufacturing complexity.Enhance heat dissipation: TCA has high thermal conductivity (usually ≥ 1 W/m · K), which can effectively transfer heat from critical components to radiators or cooling systems.Reliable mechanical bonding: These adhesives provide strong adhesion to various substrates, including silicon chips, aluminum, copper, ceramics, and plastics, ensuring long-term stable connections.Improved electrical insulation: Many TCAs have electrical insulation that prevents short circuits while maintaining excellent thermal performance.Durability and environmental resistance: The design of thermal conductive adhesive can withstand:High operating temperature (suitable for power electronics).Mechanical vibration (applicable to automotive and aerospace applications).Humidity, chemicals, and environmental pressure.Save weight and space: By replacing bulky heat sinks, clips, and mechanical fasteners, TCA helps achieve lighter and more compact designs – which is particularly important for small electronic products.The application of thermal conductive adhesive in…

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Detailed Explanation of Thermal Conductive Silicone: Application, Performance, and Optimization Selection

2025-04-18

1、 Introduction to Thermal Conductive SiliconeIn today’s increasingly miniaturized and integrated electronic devices, how to effectively solve the problem of internal heat accumulation in devices has become a technical challenge that urgently needs to be overcome. Thermal conductive silicone, as an efficient thermal conductive material, has emerged in this context and quickly gained widespread application. This article will comprehensively and deeply introduce thermal conductive silicone from multiple perspectives such as definition, classification, and working principle. 1.1 DefinitionThermal conductive silicone is a polymer compound with excellent thermal conductivity and good insulation properties, mainly composed of silicone oil, thermal conductive filler, and a small amount of additives. It can effectively fill the gap between the heating element and the heat sink, reduce the contact thermal resistance, and achieve fast and effective heat transfer.1.2 ClassificationAccording to their different forms, thermal conductive silicone can be divided into two categories: liquid (such as thermal paste) and solid (such as thermal pad); According to the usage scenario, it can be further divided into various types such as universal and specialized.2、 Working principle of thermal conductive siliconeThe reason why thermal conductive silicone can exert excellent heat dissipation effect lies in its unique physical and chemical properties:Low thermal resistance: By optimizing the formula design, the material itself has an extremely low thermal resistance value;Good wettability: It can adhere well to metal surfaces, forming a continuous and uniform thin film layer;Soft and malleable: even in the face of unevenness or small gaps, it can tightly adhere to ensure the best heat conduction path;Long term stability: resistant to high temperature aging, not easy to evaporate and dry, ensuring stable performance for a long time.3、 Application scenariosWith the development of technology, thermal conductive silicone has been widely used in various fields:Consumer electronics products: Used for heat dissipation of key components such…

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