Adhesive knowledge_Adhesive encyclopedia

Common problems and application scenarios of RTV silicone rubber

2025-04-01

In the fields of industrial manufacturing, electronic appliances, construction, and automobiles, the demand for sealing, insulation, and protection is ubiquitous. RTV silicone rubber (room temperature vulcanized silicone rubber) has become an indispensable material in modern industry due to its excellent temperature resistance, elasticity, chemical stability, and environmental characteristics. This article will comprehensively analyze the definition, types, performance advantages, and typical application scenarios of RTV silicone rubber, helping you quickly understand the core value of this “versatile” material. 1、 What is RTV silicone rubber?**RTV (Room Temperature Vulcanization Silicone Rubber) is an organic silicone material that can undergo cross-linking reaction (curing) at room temperature. It exists in liquid or paste form and undergoes chemical reactions upon contact with moisture or catalysts in the air, ultimately forming a tough elastic body. According to different curing mechanisms, RTV silicone rubber is mainly divided into two categories:Single component RTV silicone rubber (1K RTV)Ingredients: base polymer+catalyst (such as organotin or organotitanium).Curing method: Slowly cure after exposure to moisture in the air, usually taking 24-72 hours to fully cure.Features: Easy to operate, no need for mixing, suitable for mass production.Two component RTV silicone rubber (2K RTV)Ingredients: Base gel (polymer)+curing agent (catalyst).Curing method: After mixing, it reacts quickly and can be cured within minutes to hours. The curing speed can be adjusted by the ratio.Features: After curing, the mechanical properties are better, suitable for sealing and potting of precision components. 2、 Core performance advantages of RTV silicone rubber 5、 Frequently Asked Questions about RTV Silicone RubberQ1: Will RTV silicone rubber harden after curing?A： After curing, the material maintains elasticity, but the modulus (hardness) of the two-component product can be adjusted, and different hardness can be selected according to needs (such as 20-80 Shore A).Q2： How to avoid incomplete solidification?A： Ensure that the environmental humidity is ≥ 30% (single…

How to choose the appropriate potting material?

2025-03-21

Choosing the appropriate encapsulation material is crucial for protecting sensitive electronic components from adverse environmental conditions. These materials are used to protect equipment from moisture, provide insulation, and help control heat. Each material has unique advantages through options such as epoxy resin, silicone, and polyurethane, depending on the specific requirements of your application. In this article, Yilian will explore the main differences between these potting materials and help you determine which material is most suitable for your needs, ensuring long-lasting protection and optimal performance. Three common potting materialUnderstanding the unique characteristics of potting materials is crucial when selecting potting materials for your application. The three main sealing materials commonly used in electronic manufacturing are epoxy resin, silicone resin, and polyurethane. Each material has specific advantages and is suitable for different environments and performance requirements. The following is a detailed classification of each sealing material. Epoxy sealant, silicone sealant, polyurethane sealantEpoxy sealant, silicone sealant, polyurethane (PU) sealant

What is fluorosilicone gel? What is the function of fluorosilicone gel?

2025-03-20

Fluorosilicone gel is a kind of functional polymer with siloxane as the main skeleton and fluorine group introduced into the molecular structure. Due to the introduction of fluorine groups, it has excellent properties such as high temperature resistance, low temperature resistance, chemical corrosion resistance, and low dielectric constant. In recent years, with the increasing trend of miniaturization and high-performance of electronic products, fluorosilicone gel has gradually emerged in the fields of electronic packaging, sealing protection, and heat dissipation and waterproof of electrical components, becoming a new type of polymer material that has attracted much attention. Physical and chemical properties of fluorosilicone gel

What is the difference between fluorosilicone gel and ordinary silicone gel? Who is more suitable for your needs?

2025-03-20

Chemical Structure and Basic CharacteristicsFluorosilicone gel:Fluorosilicon gel introduces fluorine element (such as trifluoropropyl) into the organic silicon molecular chain, giving it unique properties. The addition of fluorine element enhances the material’s high temperature resistance, corrosion resistance, and waterproof performance.Ordinary silicone gel:The ordinary silicone gel takes the silicon oxygen bond (Si-O) as the main chain, which has good flexibility, temperature resistance and electrical insulation, but has weak adaptability to chemical corrosion and extreme environments.

What is the reason why the motor sealant becomes soft after fully curing?

2025-03-14

The phenomenon of “softening” of motor sealant after complete curing is one of the common process and product problems in the electronics and motor industries. This abnormal phenomenon may directly affect the fixing and protective effect of internal components of the motor, thereby affecting the lifespan and performance of the motor. So, the reasons for the “softening” of the sealant after complete curing are complex, usually involving multiple aspects such as raw materials, process operations, curing conditions, design selection, etc. Below, Yi Lian will provide a detailed analysis of its causes from multiple perspectives. 1、 Common reasons for the softening of sealant after complete curing

Deep Analysis of CIPG and FIPG: Definition, Differences, and Applications

2025-03-14

In industries such as electronics, electrical appliances, automobiles, and new energy, sealing technology plays a crucial role in waterproofing, dustproof, anti-corrosion, and extending service life. Among them, CIPG (Cured In Place Gasket) and FIPG (Formed In Place Gasket) are two advanced sealing technologies widely used due to their excellent sealing performance, high degree of automation, and ability to adapt to complex structures. But many people still have a vague understanding of the concepts, differences, and application scenarios of CIPG and FIPG. This article will provide a systematic and in-depth analysis of CIPG and FIPG, assisting engineers and buyers in accurately selecting suitable sealing solutions.Sealing process of battery casing 1、 Definition and working principle of CIPG and FIPG

The Application of Electronic Adhesives in Electronics: Understanding the “Invisible Heroes” Behind Electronic Manufacturing in One Article

2025-03-14

In the world of electronic products, chips, circuit boards, sensors, etc. are undoubtedly the protagonists, but there is a type of “invisible hero” that silently supports the performance and lifespan of electronic devices – that is, electronic adhesives. Today, Yilian will talk about the types, functions, application scenarios, and future trends of electronic adhesives.1、 What is electronic adhesive?Electronic adhesive is a type of adhesive specifically designed for electronic components, used for bonding, fixing, sealing, conducting electricity, conducting heat, etc. It is a chemical material that can provide mechanical support, protection, and special functions such as conductivity, insulation, and heat dissipation. Compared with ordinary glue, electronic adhesive has higher insulation, heat resistance, aging resistance and environmental adaptability, and is one of the key materials to ensure the long-term stable operation of electronic products.2、 The main function of electronic adhesiveAdhesive fixation: Fixing chips, capacitors, inductors, modules and other components to prevent displacement or damage caused by vibration or impact.Thermal conduction and heat dissipation: dissipate the heat generated during the operation of components to avoid local overheating and extend their lifespan.Electrical performance guarantee: including insulation, conductivity, meeting different functional requirements, such as conductive adhesive, insulating adhesive, etc.Sealed protection: Waterproof, dustproof, and chemically resistant, protecting precision electronic components from stable operation in harsh environments.Stress release: Reduce internal stress caused by thermal expansion and contraction, avoid solder joint cracking and circuit board deformation.3、 The main types of electronic adhesives

Characteristics and Applications of Thermal Conductive Potting Compound

2025-03-14

With the rapid development and miniaturization trend of modern electronic products, the heat dissipation requirements for electronic components are constantly increasing. How to effectively manage the heat generated by electronic devices and ensure the stability and lifespan of products has become an important issue faced by engineers. Thermal conductive potting adhesive, as a material that combines thermal conductivity and packaging protection functions, has been widely used in LED packaging, power electronics, automotive electronics, communication equipment and other fields in recent years. This article will provide a detailed analysis of the principle, material composition, performance characteristics, application fields, and future development trends of thermal conductive sealant, providing valuable references for industry professionals and related researchers.1、 Basic concept of thermal conductive sealantThermal conductive sealant is a high-performance material specifically used for packaging electronic components. Its main function is to utilize the synergistic effect of high thermal conductivity fillers (such as alumina, silicon nitride, metal powder, etc.) and polymer matrices (such as epoxy resin, silicone, etc.) to achieve fast and efficient heat conduction while ensuring electrical insulation. Compared to traditional packaging adhesives, thermal conductive potting adhesives not only effectively dissipate heat, but also have excellent characteristics such as earthquake resistance, moisture resistance, and chemical corrosion resistance, making them an important guarantee for thermal management of electronic products.2、 The main composition and process of thermal conductive sealant

Application Solution of ELAPLUS Thermal Conductive Material in Data Centers

2025-02-20

The data center is crowded with intensive servers running resource intensive processes, facing significant challenges related to heat. Overheating can limit server performance to prevent hardware damage, resulting in efficiency losses, while prolonged overheating can accelerate wear and tear, increase hardware failures, and increase the risk of costly downtime. These issues highlight the urgent need for advanced thermal management solutions to ensure optimal performance, reliability, and sustainability of high-performance data centers. In this article, let’s learn how to transform thermal management using advanced data center TIM solutions. Traditional solutions such as phase change films will deteriorate after repeated insertion and removal, such as the solution required for pluggable optical modules (POM). This degradation not only reduces thermal performance, but may also introduce volatile compounds into the data center environment, thereby damaging sensitive electronic components.In addition, these traditional methods often cannot handle the increased power density of newer transceiver designs, and the power density of each module may exceed 20W or even 35W. Due to each line card having up to 32 modules, accumulating thermal load becomes a key challenge. These inefficiencies can lead to overheating, increased energy consumption, and increased cooling costs, ultimately affecting the performance and sustainability of data centers.Given these realities, a top switch manufacturer is seeking a new innovative thermal control solution to reduce the operating temperature of its 20W transceiver application.Why effective thermal conductive material (TIM) solutions are crucial for data centersTIM plays a crucial role in bridging the small air gap between heating components and cooling solutions such as radiators or heat diffusers. If there is no effective TIM, these air gaps will become thermal barriers, reducing heat transfer efficiency and leading to various problems. The TIM solution for data centers ensures the following advantages:Avoiding performance degradation: Overheating can cause the processor and other components…