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Application Solution of ELAPLUS Thermal Conductive Material in Data Centers

2025-02-20

The data center is crowded with intensive servers running resource intensive processes, facing significant challenges related to heat. Overheating can limit server performance to prevent hardware damage, resulting in efficiency losses, while prolonged overheating can accelerate wear and tear, increase hardware failures, and increase the risk of costly downtime. These issues highlight the urgent need for advanced thermal management solutions to ensure optimal performance, reliability, and sustainability of high-performance data centers. In this article, let’s learn how to transform thermal management using advanced data center TIM solutions. Traditional solutions such as phase change films will deteriorate after repeated insertion and removal, such as the solution required for pluggable optical modules (POM). This degradation not only reduces thermal performance, but may also introduce volatile compounds into the data center environment, thereby damaging sensitive electronic components.In addition, these traditional methods often cannot handle the increased power density of newer transceiver designs, and the power density of each module may exceed 20W or even 35W. Due to each line card having up to 32 modules, accumulating thermal load becomes a key challenge. These inefficiencies can lead to overheating, increased energy consumption, and increased cooling costs, ultimately affecting the performance and sustainability of data centers.Given these realities, a top switch manufacturer is seeking a new innovative thermal control solution to reduce the operating temperature of its 20W transceiver application.Why effective thermal conductive material (TIM) solutions are crucial for data centersTIM plays a crucial role in bridging the small air gap between heating components and cooling solutions such as radiators or heat diffusers. If there is no effective TIM, these air gaps will become thermal barriers, reducing heat transfer efficiency and leading to various problems. The TIM solution for data centers ensures the following advantages:Avoiding performance degradation: Overheating can cause the processor and other components…

Condensation type electronic potting compound and addition type electronic potting compound

2025-02-18

Condensation CureCondensation type electronic sealing adhesive is a type of material that solidifies through condensation reactions, usually formed by reacting silicone rubber or polyurethane resins with curing agents. The curing process usually releases small molecular substances such as water or alcohol. The main characteristics of this type of sealant are as follows: Characteristic* Curing method: The curing reaction of condensation sealant is usually carried out by heating or reacting with a curing agent at room temperature. During the solidification process, colloidal molecules interconnect and release small molecule substances.* Longer curing time: Compared to addition molding sealant, condensation molding sealant usually has a longer curing time, especially in humid environments where the curing rate may be slower.* Applicable environment: Suitable for applications with low curing temperature requirements, such as use under low or normal temperature conditions.* Chemical stability: After curing, it has good chemical stability, heat resistance, and weather resistance, especially strong corrosion resistance in high humidity and acid-base environments.* Disadvantage: During the condensation reaction, volatile substances such as water or alcohols may be released, which may corrode or affect the performance of sensitive electronic components.Typical applications* Silicone potting: For example, used for waterproofing, sealing, and insulation protection of electronic devices, home appliance components, sensors, etc.* Transformers and power equipment: provide excellent insulation performance, high temperature resistance, and corrosion resistance.* LED and lamp packaging: Provides waterproof, moisture-proof, and dustproof functions.Addition Cure for Electronic potting compoundAdditive electronic sealant is cured through addition reactions, such as those of silane, silane, or other monomers. The curing process does not involve the release of small molecules, so the curing reaction is very clean and does not produce volatile by-products. The characteristics of additive electronic sealant are as follows: Characteristics: Typical applications* PCB protection: Provides waterproof, dustproof, and corrosion-resistant protection for sensitive circuit boards, commonly used…

Elaplus elaborates on the causes and prevention methods of adhesive bubble formation

2025-02-12

The appearance of bubbles during the manufacturing process is a common and challenging issue in adhesive applications. Although these bubbles may seem insignificant, their impact on adhesive strength, reliability, and appearance quality can be profound. Understanding the causes and potential impacts of bubble formation, as well as how to prevent or reduce their occurrence, is key to ensuring the success of adhesive applications.The consequences of adhesive bubblesBubbles are not just visual defects, they may form gaps structurally, significantly reducing the load-bearing capacity of joints and weakening adhesive strength, especially in fields such as aerospace or medical equipment that require high safety. Bubbles can concentrate stress under mechanical loads or temperature changes, making joints more prone to failure.In certain industries, especially those that require precise proportioning of resins and curing agents, the presence of bubbles is more severe. Residual air can interfere with chemical reactions, leading to incomplete curing and subsequently reducing adhesive strength. This situation not only affects functionality, but may also cause serious problems in appearance, especially in applications with high transparency or decorative requirements, where bubbles can significantly reduce the aesthetic appeal of the product.In addition, the presence of bubbles will occupy the space of the adhesive, reduce its coverage, lead to uneven bonding, and thus affect the airtightness or water tightness, resulting in a decrease in sealing performance and ultimately increasing production costs. Defects caused by bubbles may require rework or replacement, and additional quality control measures may be taken, which not only consumes time and cost, but also affects the durability and functionality of the product. Therefore, preventing bubbles is crucial for ensuring the quality and performance of the product.Adhesive bubbles. Reasons for bubble formationUnderstanding the mechanism of bubble formation is the first step in solving problems. Common sources of bubbles include the following:The interaction between…

Comprehensive understanding of electric vehicle sensors and Elaplus adhesive application solutions

2025-02-12

What is an EV sensor?A、 Understand automotive sensorsAutomotive sensors are one of the essential components of advanced automobiles. It is an electronic system that can monitor various parameters (temperature, coolant system, etc.), faults, and obstacles, issue warnings to the driver, and send signals to the ECU (Electronic Control Unit) for appropriate adjustments.B、 What are the sensors in electric vehicles?In the coming year, with the advancement of technology, the popularity of electric vehicles (EVs) will continue to accelerate rapidly. According to the International Energy Agency, global electric vehicle sales exceeded 10 million units in 2022. It is undeniable that electric vehicles support us in moving towards a more sustainable lifestyle and reducing carbon emissions. Like traditional cars, electric vehicle sensors are also key components for controlling electric vehicle systems, ensuring safety and performance. However, as the energy source of electric vehicles comes from the battery system, the sensors of electric vehicles also change accordingly. Position sensor Current sensor Voltage sensor Temperature sensor Assisted autonomous driving sensor Collect mechanical motion data of traction motors to ensure coordinated operation of the system. After recording the angular position data, the motor controller or motor control unit (MCU) converts it into electrical pulses to initiate the feedback loop Measure voltage in multiple ways, from measuring high voltage to detecting low current levels, to ensure that the insulation of the battery pack and each battery is not damaged. Temperature sensors are of great significance in electric vehicles, ensuring passengers are safer and more comfortable throughout their journey. Elaplus is committed to researching and improving overall solutions specifically for temperature sensors in electric vehicles In the battery system, it is directly installed in the battery cells, providing accurate temperature measurement and adjusting the heating and cooling processes to ensure that each battery cell operates within a safe…

Application of Thermal Conductive Adhesive in Electronic Products: Key Materials for Improving Heat Dissipation Performance

2025-01-17

With the rapid development of technology, the functions of electronic products are constantly upgrading, and the performance requirements are becoming increasingly high. Whether it is smartphones, computers, tablets, or consumer electronics products such as televisions and LED lights, heat dissipation has become an important challenge in the design and manufacturing process. In order to effectively solve this problem, thermal conductive adhesive, as an advanced heat dissipation material, is increasingly being applied in various electronic products. Future Trends: Innovation and Development of Thermal Conductive AdhesiveWith the continuous advancement of electronic technology, the application fields of thermal conductive adhesives will also continue to expand. Especially in fields such as 5G communication, high-performance computing, and artificial intelligence, the demand for thermal conductive adhesives will become more urgent. The future thermal conductive adhesive not only requires higher thermal conductivity, but also meets higher environmental standards, more complex application environments, and longer service life.For example, with the rise of smart wearable devices and new energy vehicles, thermal conductive adhesives will take on more heat dissipation tasks, especially in the heat dissipation management of key components such as batteries and motors. The application of thermal conductive adhesives will become increasingly important.Thermal conductive adhesive, as an important heat dissipation material, has broad application prospects in electronic products. The application of thermal conductive adhesive can effectively improve the performance and reliability of products, whether in smartphones, LED lighting, computers, or emerging fields such as 5G communication and electric vehicles. With the continuous advancement of technology, the types, properties, and applications of thermal conductive adhesives will become more diverse, becoming an indispensable key material for future electronic products.Label: Application of thermal conductive gel, thermal conductive adhesive and thermal conductive adhesive in electronic products Basic concept of thermal conductive adhesiveThermal conductive adhesive, as the name suggests, is a type of…

What is the thermal conductivity efficiency of thermal conductive adhesive?

2025-01-14

Thermal conductive adhesive, as an efficient thermal conductive material, plays an important role in modern industry and electronic technology, significantly improving equipment heat dissipation performance and extending product service life. This article will provide a detailed introduction to the thermal conductivity efficiency of thermal conductive adhesive and its influencing factors, and analyze its wide application and selection points. Thermal conductive adhesive1、 Definition of Thermal Conductivity Efficiency of Thermal Conductive AdhesiveThe thermal conductivity efficiency of thermal conductive adhesive usually refers to its ability to transfer heat from high temperature areas to low temperature areas. This ability is mainly determined by the thermal conductivity of the thermal conductive adhesive, measured in W/m · K (watts per meter Kelvin). The higher the thermal conductivity, the faster and more effective the thermal conductive adhesive can transfer heat, and the stronger its heat dissipation performance.In practical applications, thermal conductive adhesive not only relies on the thermal conductivity of its material itself, but also involves multiple factors such as coating thickness, compactness after curing, and thermal resistance between it and the contact surface.2、 Key influencing factors of thermal conductivity efficiency of thermal conductive adhesive Usage environmentThe usage environment of thermal conductive adhesive, such as working temperature, humidity, mechanical stress, etc., can also affect its thermal conductivity efficiency. For example, in high-temperature environments, thermal conductive adhesives need to have higher temperature resistance to ensure their long-term stable thermal conductivity. Thermal conductive adhesive3、 Typical application areas of thermal conductive adhesiveHeat dissipation of electronic componentsThermal conductive adhesive is widely used in the heat dissipation system of electronic components such as chips, processors, and power modules. By transferring heat from the heat source to the heat sink or radiator, the operating temperature of the device can be significantly reduced, avoiding performance degradation or failure caused by overheating.Heat dissipation of LED…

Elaplus tells you, how do temperature and humidity affect adhesives?

2025-01-14

Temperature and humidity are important environmental factors that affect the performance of adhesives. They play a crucial role in the application of adhesives, directly affecting their curing, bonding strength, durability, and reliability. Here are several aspects of how temperature and humidity affect adhesives:1、 The influence of temperature on adhesivesThe influence of temperature on adhesives is mainly reflected in curing speed, bonding strength, toughness, and durability.How do temperature and humidity affect adhesives (1) Curing processHigh temperature: High temperature can accelerate the curing reaction of certain adhesives (such as epoxy resin, polyurethane, etc.). Most thermosetting adhesives cure faster at higher temperatures, which is very useful in some fast-paced industrial processes. However, excessively high temperatures may cause excessive reaction or incomplete curing of the adhesive, affecting its final performance.Low temperature: At low temperatures, the curing process of adhesives usually slows down, and some adhesives may not fully cure, resulting in insufficient bonding strength. Especially thermosetting adhesives, their curing speed and performance will significantly decrease at low temperatures. Low temperature may also make the adhesive more viscous, affecting the operability of glue application.(2) Adhesive strength and toughnessHigh temperature: At high temperatures, the bonding strength and stiffness of many adhesives will weaken, especially thermoplastic adhesives, which are prone to softening or plasticization, leading to a decrease in bonding strength. Some adhesives may fail when the temperature exceeds their tolerance limit.Low temperature: Low temperature may cause some adhesives to become brittle, reducing their bonding strength and toughness. Especially for rubber based adhesives and other low-temperature curing adhesives, they may become prone to cracking in cold environments.(3) Thermal expansion and contractionTemperature changes: Temperature changes can cause differences in the thermal expansion coefficients of adhesives and substrates, which may lead to stress concentration at the bonding interface and affect the bonding strength. For example, when the temperature rises,…

What is VOC? Does the adhesive sealant contain VOC?

2025-01-03

What is VOC? VOC stands for Volatile Organic Compounds, a type of organic compound that easily evaporates at room temperature. They have high vapor pressure and low water solubility, and can enter the air through evaporation, participate in chemical reactions, and form photochemical smog or air pollutants. Common VOC include formaldehyde, benzene, toluene, ethanol, ethyl acetate, etc.VOC come from a wide range of sources, including industrial production, building materials, daily chemicals such as coatings, cleaning agents, adhesives, and transportation. Adhesive sealant, as a common chemical material used in construction and industry, may contain VOC in its composition.The impact of VOC on health and the environmentThe impact on healthShort term exposure: can cause symptoms such as dizziness, headache, nausea, throat and eye irritation.Long term exposure: Certain VOCs (such as benzene) are considered carcinogenic and may cause chronic respiratory diseases and neurological damage.The impact is greater on sensitive populations such as children, pregnant women, and the elderly.Impact on the environmentVOC and nitrogen oxides undergo chemical reactions under sunlight, generating ozone and photochemical smog, becoming one of the important causes of air pollution.VOC emissions may also lead to indoor air pollution and global warming.Does the adhesive sealant contain VOCsWhether adhesive sealant contains VOCs mainly depends on its type and formula composition. Traditional sealantMany early formulations of sealants contained highly volatile organic solvents, such as toluene and ethyl acetate, which were the main sources of VOCs. During use and curing, these solvents will evaporate into the air, causing adverse effects on human health and the environment.Modern environmentally friendly sealantWith the increasing demand for environmental protection, more and more adhesive sealants are adopting low VOC or VOC free formulas, mainly divided into the following categories:Water based sealant: Using water as a solvent, it contains almost no VOCs and is widely used in indoor decoration and…

Elaplus elaborates on the role of encapsulation materials in electronic products

2024-12-31

In modern electronic products, encapsulation materials are widely used as important auxiliary materials for packaging, protecting, and enhancing the performance of various electronic components. Sealing is not only a physical protection process, but also plays a crucial role in improving equipment reliability, extending service life, and ensuring safety. This article will delve into the role of encapsulation materials in electronic products, with a focus on analyzing their applications in improving electronic device performance, protecting electrical components, and optimizing product structure. I. Definition and types of sealing materialsEncapsulation materials generally refer to high-performance materials used for sealing and protecting electronic components, usually in liquid or paste form. When in use, they are covered on the surface of components or circuit boards through methods such as pouring or coating, and after curing, they form a strong protective layer. Common sealing materials include epoxy resin, silicone, polyurethane, acrylic resin, etc.These sealing materials have different characteristics, and suitable products can be selected according to actual needs. For example, epoxy resin has excellent mechanical strength and chemical resistance, making it suitable for high-temperature and corrosion-resistant applications; Silicone, on the other hand, has good flexibility and low temperature resistance, making it suitable for environments that require high elasticity and resistance to high and low temperatures.II. The main role of encapsulation materials in electronic products