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Thermal Conductive Material for Electronic Industry

Thermal conductive material is a material used to promote heat conduction and its main role is to conduct heat from one place to another place to achieve the purpose of heat dissipation or heating. Thermal conductive materials usually have good thermal conductivity and electrical conductivity and can transfer heat effectively, so as to maintain the stable operation of equipment or systems.

ELAPLUS thermal materials can be divided into many types:

1.Thermal paste (thermal grease) : Thermal paste is a semi-solid or semi-flowing material containing a high thermal conductivity material, often used to fill the gap between electronic components and heat sinks to improve heat dissipation efficiency.

2.Thermal conductive silicone gasket: Thermal conductive silicon gasket is a soft silicone material with good thermal conductivity and insulation properties, which is often used for the contact between the heat dissipation and insulation of electronic components.

3.Thermal conductive adhesive: Thermal conductive adhesive is a material that can simultaneously play a bonding and thermal conductive role, commonly used to fix radiators or other heat dissipation components and promote heat conduction.

4.Thermal conductive gap filler:Thermal insulation gasket is a material with thermal conductivity and insulation properties, which is often used for the contact between the heat dissipation and insulation of electronic components.

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Product Feature

FEATURES

导热系数
Conductivity

1.0~6.0W/m.k

耐高低温
Temperature-resistance range

-40~200℃

阻燃等级
Flame Retardant Rating

UL 94 V-0

击穿电压
Breakdown voltage

≥7.0Kv/mm

应用范围
Application area

Lithium batteries, automotive electronics, communication facilities

保质期
Shelf Life

12months

Product parameters sheetPRODUCT PROPERTIES TABLE

Model SIPC 8125Potting Compound SIPC 8130Potting Material SIPC 8230Potting Material SIPC 8020FOAMFoam Adhesive SIPC 8237Potting Material SIPC 8230-15Potting Material SIPC 8230-30Potting Material SIPC 8606Potting Material Test Method
Type(mm) Condensed Type Condensed Type Addition-cured Type Addition-cured Type Addition-cured Type Addition-cured Type Addition-cured Type Silicone ——
Color Transparent/Colorless White/Black/Transparent White/Black Transparent/Black White White/Black White/Black Colorless/Colorless Visual Inspection
Mix Ratio 100/10 100/10 100/100 100/100 100/100 100/100 100/100 100/100 Mass Ratio
Conductivity KV/m.k 0.24 0.4 0.75 0.07 0.15 1.5 3.0 0.22 GB/T 10297-1998
HardnessShoreC 22A 40A 55A 60shore00 75shore00 25 32 70 Cone Penetration GB/T 531-2008
Densityg/cm3 A1.02 B0.98 A1.35 B0.98 A1.60 B1.60 A0.99 B0.99 A0.70 B0.700 A2.26 B2.60 A3.2 B3.2 A0.99 B0.99 GB/T 13354-92
Shear StrengthMPa 0.3 0.7 - - - 0.25 0.25 0.22 GB 6328-86
Mix Viscosity 1000 2200 3500 700 2000 4300 9000 750 GB/T 10247-2008
Temperature range℃ -50~150 -50~150 -60~250 -50~200 -60~200 -60~200 -60~200 -60~250 GBT 20028-2005
Breakdown VoltageKv/mm 20 20 15 13 20 ≥20 15 25 ASTM D149
Volume resistivityΩ·cm 2014 2014 2014 1013 1114 1113 1211 1015 GB/T 1692-92
Dielectric Constant@10MHz 3 3 3 2 2.3 4.8 4.8 2.8 GB/T 1693-2007
Flame Retardant Rating V—0 V—0 V—0 V—0 V—0 V—0 V—0 V—0 UL 94
Expansion CoefficientCETppm 200 120 230 300 230 130 130 300 HGT 2625-1994

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