Conductivity
1.0~6.0W/m.k
Thermal conductive material is a material used to promote heat conduction and its main role is to conduct heat from one place to another place to achieve the purpose of heat dissipation or heating. Thermal conductive materials usually have good thermal conductivity and electrical conductivity and can transfer heat effectively, so as to maintain the stable operation of equipment or systems.
ELAPLUS thermal materials can be divided into many types:
1.Thermal paste (thermal grease) : Thermal paste is a semi-solid or semi-flowing material containing a high thermal conductivity material, often used to fill the gap between electronic components and heat sinks to improve heat dissipation efficiency.
2.Thermal conductive silicone gasket: Thermal conductive silicon gasket is a soft silicone material with good thermal conductivity and insulation properties, which is often used for the contact between the heat dissipation and insulation of electronic components.
3.Thermal conductive adhesive: Thermal conductive adhesive is a material that can simultaneously play a bonding and thermal conductive role, commonly used to fix radiators or other heat dissipation components and promote heat conduction.
4.Thermal conductive gap filler:Thermal insulation gasket is a material with thermal conductivity and insulation properties, which is often used for the contact between the heat dissipation and insulation of electronic components.
Learn MoreFEATURES
1.0~6.0W/m.k
-40~200℃
UL 94 V-0
≥7.0Kv/mm
Lithium batteries, automotive electronics, communication facilities
12months
Model | SIPC 8125Potting Compound | SIPC 8130Potting Material | SIPC 8230Potting Material | SIPC 8020FOAMFoam Adhesive | SIPC 8237Potting Material | SIPC 8230-15Potting Material | SIPC 8230-30Potting Material | SIPC 8606Potting Material | Test Method |
Type(mm) | Condensed Type | Condensed Type | Addition-cured Type | Addition-cured Type | Addition-cured Type | Addition-cured Type | Addition-cured Type | Silicone | —— |
Color | Transparent/Colorless | White/Black/Transparent | White/Black | Transparent/Black | White | White/Black | White/Black | Colorless/Colorless | Visual Inspection |
Mix Ratio | 100/10 | 100/10 | 100/100 | 100/100 | 100/100 | 100/100 | 100/100 | 100/100 | Mass Ratio |
Conductivity KV/m.k | 0.24 | 0.4 | 0.75 | 0.07 | 0.15 | 1.5 | 3.0 | 0.22 | GB/T 10297-1998 |
HardnessShoreC | 22A | 40A | 55A | 60shore00 | 75shore00 | 25 | 32 | 70 Cone Penetration | GB/T 531-2008 |
Densityg/cm3 | A1.02 B0.98 | A1.35 B0.98 | A1.60 B1.60 | A0.99 B0.99 | A0.70 B0.700 | A2.26 B2.60 | A3.2 B3.2 | A0.99 B0.99 | GB/T 13354-92 |
Shear StrengthMPa | 0.3 | 0.7 | - | - | - | 0.25 | 0.25 | 0.22 | GB 6328-86 |
Mix Viscosity | 1000 | 2200 | 3500 | 700 | 2000 | 4300 | 9000 | 750 | GB/T 10247-2008 |
Temperature range℃ | -50~150 | -50~150 | -60~250 | -50~200 | -60~200 | -60~200 | -60~200 | -60~250 | GBT 20028-2005 |
Breakdown VoltageKv/mm | 20 | 20 | >15 | >13 | >20 | ≥20 | 15 | 25 | ASTM D149 |
Volume resistivityΩ·cm | 2014 | 2014 | 2014 | 1013 | 1114 | 1113 | 1211 | 1015 | GB/T 1692-92 |
Dielectric Constant@10MHz | 3 | 3 | 3 | 2 | 2.3 | 4.8 | 4.8 | 2.8 | GB/T 1693-2007 |
Flame Retardant Rating | V—0 | V—0 | V—0 | V—0 | V—0 | V—0 | V—0 | V—0 | UL 94 |
Expansion CoefficientCET(ppm) | 200) | 120 | 230 | 300 | 230 | 130 | 130 | 300 | HGT 2625-1994 |