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Integrated adhesive solution for electronic devices

Industrial electronics

Industrial electronics

Industry Application Consumer Electronics

How to Select Inductor Fixing Adhesives: Fluidity, Thixotropy and Temperature Resistance Must Be Considered Simultaneously

Inductors, coils and magnetic cores are key components in power modules, filters, automotive electronic control units, communication equipment and industrial control systems. During transportation vibration, equipment operation and temperature cycling, inductors may shift, and magnetic cores can become loose due to mechanical shock. Solder joints bear sustained loads from component weight and vibration, which easily leads to fatigue cracking. Applying fixing adhesives to structurally reinforce inductor bases, magnetic cores and coils can share stress on solder joints and improve long-term reliability. I. Three Core Considerations for Selecting Inductor Fixing Adhesives Can the adhesive stay in the designated area? Inductors are usually surrounded by pads, pins and other components. Adhesives with excessive fluidity tend to flow and contaminate restricted zones. For…

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How to Select MEMS Encapsulation Adhesives: Low Stress, Low Shrinkage and Matched Thermal Expansion Are Critical

MEMS pressure sensors, inertial sensors, accelerometers, gyroscopes, microphones and other devices generally incorporate miniature sensitive chips, micromechanical structures and precision electrodes. Such components are extremely susceptible to mechanical stress. Excessive cure shrinkage or high modulus of encapsulation adhesives, or a large mismatch in coefficient of thermal expansion (CTE) between the adhesive and chips, may lead to zero drift, sensitivity deviation and even structural damage. Therefore, when selecting MEMS encapsulation adhesives, bonding strength alone is not sufficient; priority should also be given to whether the material can relieve stress. I. Three Common Adhesive Application Zones in MEMS Packaging 1. Precision Bonding of MEMS Chips Chips need to be accurately fixed onto substrates while avoiding excessive shrinkage stress exerted on chips by…

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How to Select Adhesives for Bonding Motor Magnets & Magnet Segments — Reliable Bonding Solutions for High-Speed Motors

Why Do Motor Magnets/Magnet Segments Require Specialized Adhesives? In permanent magnet synchronous motors (PMSM), brushless DC motors (BLDC), servo motors and robot joint motors, magnets (magnet segments) are generally fixed onto the inner wall of rotors. As motors evolve toward higher power density, higher rotational speed and miniaturization, magnet bonding materials must deliver sufficient bonding strength while maintaining stable performance under high centrifugal force, high-temperature cycling and long-term vibration. Insufficient bonding performance may lead to: ■ Magnet detachment ■ Rotor unbalance ■ Increased motor noise ■ Reduced output torque ■ Failure during high-speed operation ■ Shortened motor service life Therefore, magnet bonding adhesive has become a critical material affecting reliability in motor manufacturing. Required Performance Specifications for Magnet & Magnet Segment Adhesives Motor Magnet Adhesive High…

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How to Select Potting Compound for Strain Gauge Pressure Sensors? ELAPLUS EP 2016 AB Flexible Epoxy Solution Reduces Stress and Improves Measurement Stability

The core of a strain gauge pressure sensor lies in its sensitive element, which captures tiny deformations and converts pressure variations into electrical signals. Such sensors are highly susceptible to structural stress. If the potting material is overly rigid, or generates excessive curing shrinkage and thermal stress, it will impose extra loads on strain gauges, solder joints, leads and sensitive cores, resulting in zero drift, fluctuating sensitivity and poor long-term measurement stability. Therefore, when choosing potting compounds for pressure sensors, hardness alone is not the key factor. Priority should be given to materials featuring flexibility and low stress, reliable adhesion, stable temperature resistance, contamination resistance, oil resistance and long-term fixation performance. For strain gauge pressure sensors, high-temperature resistant sensors, soft…

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Potting Compound Selection for EMI Filter PCBs – ELAPLUS PUR 1635 Polyurethane Potting Compound Delivers Waterproof, Flame-Retardant & Insulating Protection

EMI filter circuit boards are widely integrated into power supplies, electronic controllers, industrial equipment, communication hardware, new energy systems and other assemblies. Their core function is to suppress electromagnetic interference and stabilize circuit performance. Filter PCBs are densely populated with inductors, capacitors, solder joints, terminals, PCB traces, alongside plastic and metal housings. During long-term operation, these components are exposed to multiple hazards including moisture, dust, vibration, temperature cycling and electrical safety risks. Therefore, when selecting potting adhesive for EMI filter motherboards, full filling capacity alone is insufficient. Critical performance metrics to evaluate include electrical insulation, water & moisture resistance, flame retardancy, flexibility, low shrinkage, weatherability and adhesion to various substrates. For EMI filter PCB potting applications, Elaplus Functional Materials (Shanghai) Co.,…

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How to Select Potting Compound for Start-Stop Controllers: ELAPLUS EP 1712 Flame-Retardant Epoxy Potting Compound for Potting & Protection of Controllers, ECUs and Power Modules

Are you searching for potting adhesives for start-stop controllers, general controllers, ECUs and power supplies? It is critical to select an electronic potting material that simultaneously delivers insulation, moisture resistance, flame retardancy, crack resistance, bonding fixation and long-term reliable protection. For automotive start-stop controllers, ECU boards, power control modules, sensor circuit boards and other applications, ELAPLUS Functional Materials (Shanghai) Co., Ltd. recommends ELAPLUS EP 1712 flame-retardant epoxy potting compound. EP 1712 is a two-component solvent-free room-temperature curing epoxy potting compound. It features moderate flowability after mixing and certain anti-leakage performance. Fully cured material boasts high hardness, favorable toughness, outstanding adhesion and electrical insulation, superior waterproof and moisture-proof properties, and meets UL 94 V-0 flame retardant rating. It is suitable for…

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