SIPA 1820-1K One-Component Heat-Curable Silicone Adhesive | Ideal Solution for Enclosure CIPG Sealing
In applications such as automotive electronics, new energy vehicles, industrial controls, motor control boxes, electric vehicle water pumps and heating components, reliable enclosure sealing is critical to long-term stable product operation. Given the demands for wide temperature resistance, moisture proofing, vibration resistance, structural stress relief and automated production, traditional sealing methods are gradually being replaced by Cured-In-Place Gasket (CIPG) in-situ sealing technology. ELAPLUS SIPA 1820-1K is a one-component heat-curable silicone adhesive developed for enclosure CIPG sealing, providing customers with stable, reliable and high-efficiency solutions for housing sealing and bonding. Product Overview ELAPLUS SIPA 1820-1K is a thixotropic paste-type one-component silicone adhesive cured by heating. It is eco-friendly, non-toxic and easy to use. After curing, it forms flexible silicone elastomer featuring…