What adhesive is used for bonding electronic component shells? ——PUR 1680 (D70) A/B polyurethane sealant professional solution
Against the backdrop of the continuous development of electronic products towards lightweight, high reliability, and extreme environmental resistance, shell bonding and internal encapsulation have become key factors affecting the stability of electronic devices. Whether it is communication equipment, sensors, control power supplies, or ignition controllers, internal components all face challenges such as humidity, vibration, temperature shock, electrical interference, and outdoor exposure. In order to enhance the overall assembly strength and protect internal components, Yilian has launched PUR 1680 (D70) A/B high hardness polyurethane sealant, specifically designed for bonding and sealing electronic component housings.1、 Core advantages of PUR 1680 (D70) A/B polyurethane sealant