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Integrated adhesive solution for electronic devices

Industrial electronics

Industrial electronics

Industry Application Consumer Electronics

Application of Elaplus UV Moisture Organic Silicone Adhesive in New Energy Vehicles

1、 The current situation of the electronic adhesive market for new energy vehiclesNew energy vehicles are reshaping the global automotive industry at an unprecedented pace. According to industry forecasts, global sales of new energy vehicles will exceed 20 million units by 2025, and the penetration rate of the Chinese market will reach over 50%. In this grand context, the electrification rate of automobiles continues to increase – the number of electronic components used in a mid to high end new energy vehicle has grown from hundreds of traditional fuel vehicles to thousands. Lithium battery encapsulationAlong with the explosive growth in the number of electronic components, the demand for reliability is also constantly increasing. The working environment of new energy vehicles…

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Why does the electrode controller need to be sealed? A high thermal conductivity silicone sealant solves the problems of heat dissipation and protection

In new energy vehicles, energy storage systems, and industrial control equipment, electrode controllers play an important role in current control and signal processing.Due to its internal integration of power devices, control chips, electrode interfaces, and drive circuits, it will face complex environments such as high temperature, humidity, vibration, and electrical shock during long-term operation. Thermal conductive sealant for industrial controllersThermal conductive sealant for industrial controllersIf there is a lack of reliable packaging protection, it is easy to: Moisture in components can cause short circuits or failuresHigh power devices generate heat, resulting in excessive temperature riseFatigue of solder joints or loosening of components under vibration environmentDust or corrosive gases entering, causing a decrease in electrical performanceTherefore, in the fields of industrial…

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The secret of increasing the sealing efficiency of the shell by 5 times: CIPG process+UV 3306

Why are more and more engineers giving up O-rings?If you have disassembled a car engine or electronic controller, you must have seen a large number of rubber O-rings and sealing gaskets. These seemingly inconspicuous small parts undertake important tasks: Prevent liquid leakage and maintain shell sealing. But as the structures of new energy vehicles and electronic devices become increasingly complex,Traditional seals are exposing more and more problems: ❌ Low assembly efficiency❌ Installation is prone to errors❌ Structural design is limited❌ Low degree of automation So, a new sealing process is rapidly becoming popular: CIPG (Cured In Place Gasket) in-situ molding sealing technology. What is CIPG sealing process?Simply put, there is no need to prefabricate seals, simply glue to form a…

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Module semiconductor cooling solution | TCMP 3380 thermal conductive gel 8.4W/M · K high thermal conductivity

With the rapid development of high-speed electronic products such as 5G communication, data centers, and optical modules, device power consumption and heat generation have sharply increased, and thermal management has become a key factor restricting product performance. Elion ELAPLUS launched TCMP 3380 high-performance heatable gel, which is specially designed for precision electronic devices such as optical modules and semiconductors, to help engineers easily solve the problem of heat dissipation in narrow spaces. ELAPLUS TCMP 3380One component heat curable silicone thermal conductive gel | Heavy engineering type Thermal conductivity, 8.4 W/m·KMinimum thickness, 250 μmTemperature resistance range, -40℃~+200℃Heavy Industry,Peel off without residueEight core advantages🔥Rapid heat conduction8.4W/m · K high thermal conductivity, fast heat conduction, effectively reducing device temperature🛡️Relieve stressAfter curing, an elastic…

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Thermal Management and Thermal Conductive Material Solution for Optical Modules

As data centers evolve towards 400G, 800G, and even 1.6T rates, the power consumption and heat generation of optical modules have sharply increased, and thermal management has become a key bottleneck restricting the performance of optical communication systems. As a professional electronic adhesive supplier, ELAPLUS has launched high-performance thermal conductive material solutions for optical module thermal management, helping you easily cope with high-power density heat dissipation challenges. The core challenges faced by thermal management of optical modulesDuring the operation of high-speed optical modules, key components such as DSP chips and TOSA/ROSA components generate a large amount of heat. If heat cannot be dissipated in a timely manner, it will cause device temperature rise, wavelength drift, signal distortion, and seriously affect…

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PCB board waterproof and moisture-proof potting

In today’s increasingly sophisticated electronic and electrical products, PCB circuit boards are facing increasingly severe environmental challenges. Water vapor erosion is one of the main factors leading to quality problems and decreased reliability of electronic products. Moisture may cause short circuits, corrosion, decreased insulation performance, and even product failure in PCB boards. As a professional electronic adhesive supplier, ELAPLUS provides you with a comprehensive PCB board waterproof and moisture-proof sealing strategy to safeguard the safe and reliable operation of electronic products. Water vapor, the invisible killer of electronic productsThere are a large number of solder joints, components, and copper lines distributed on the surface of PCB circuit boards, which are highly susceptible to moisture damage in humid environments. Water molecules…

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Bonding • Sealing • Thermal conductive

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