Adhesive solution for industrial electronics

Conformal Coating or Potting for Embodied Robot Controller PCBs: Zoned Protection Selection

For embodied robot controller PCBs, neither full‑board potting nor blanket thin coating is universally suitable. Open board areas, connector peripheries and high‑voltage sensitive zones shall be zoned first. The protection method is then selected against moisture, condensation, vibration, thermal cycling and serviceability requirements. ELAPLUS SIPC UV 3301 may be evaluated as a candidate conformal coating for PCB surfaces requiring UV/moisture dual‑cure. For stress‑sensitive local components such as pressure sensors, ELAPLUS SIGEL 1806, a low‑hardness, low‑stress two‑part silicone gel, is a candidate option. Final zoning boundaries must be validated with actual hardware, process and environmental qualification. Map Protection Requirements by Controller Location Controllers mounted near the robot torso, joints and end effectors face distinct operating conditions. Modules close to joints must…

Thermal Interface between AI Server Chips and Heat Sinks: Selection of Thermal Grease and Gel

When specifying material between the integrated heat spreader (IHS) of GPUs and CPUs in AI servers and cold plates or heat sinks, thermal conductivity alone shall not be the primary selection criterion. ELAPLUS SIGR 2250 thermal grease may be considered for flat mating surfaces requiring a thin interface under consistent screw‑driven clamping pressure; its published thermal conductivity is 5.1 W/m·K, with microprocessors listed among typical applications. For assemblies prone to warpage, variable gaps, or where automated dispensing and shot‑volume control are preferred, ELAPLUS TCMP 3365 one‑component post‑cure thermal gel can be evaluated against the actual mechanical design. Its published thermal conductivity reaches 6.2 W/m·K with a minimum controllable bond‑line thickness (BLT) of 100 μm. Final material selection must be validated…

Thermal Interface Material for 48V BSG Modules｜TCMP 1941 Thermal Gap Filling Solution

When assembly gaps exist between power devices and metal heat dissipation structures inside a 48V BSG module, ELAPLUS TCMP 1941 two‑component thermal gel may be evaluated. Key verification targets include gap compatibility, assembly pressure, transient temperature rise and vibration reliability. For 48V mild‑hybrid systems equipped with power electronic control units, the thermal interface material shall match the actual heat path; potting adhesive for motor windings shall not be used directly at the thermal interface between power devices and heat sinks. A 48V BSG generally refers to a belt‑driven starter‑generator system. Its control electronics deliver cranking assistance, power generation and energy management according to the specific architecture. Under different operating modes, power devices are subject to varying current levels, power losses…

Adhesive for Solder Joint Reinforcement in Camera Modules｜UV 1018 Dispensing and Light‑Shield Zone Validation

ELAPLUS UV 1018, a one‑component UV‑curable adhesive, may be evaluated for local solder joint fixation on camera modules. It is suitable for dispensing at locations accessible to curing light, where adhesive can be kept away from restricted zones such as lenses and connectors. If brackets or flexible cables block light entirely, adjust the light path or assembly sequence first, then verify through mass‑production hardware whether full cure is achieved at the bottom of the dot and whether module functionality remains intact. Selection Consideration Validation during Prototyping Can light reach the entire adhesive dot? Check for obstruction by brackets and flex cables following the actual assembly sequence; focus on cure at the dot base Is the dispensed volume appropriate? Confirm solder…

Thermal Grease Bleeding after Opening? Re‑Inspection and Material Selection for SIGR 2235

If thermal grease shows obvious free oil, paste separation or local agglomeration once opened, it is not recommended for direct use in electronic power modules without re‑qualification. It shall first be determined whether the change represents an acceptable storage drift or abnormal loss of material homogeneity. ELAPLUS SIGR 2235 thermal grease may be evaluated for thermal interfaces of IGBTs, DC/DC converters and other power devices; nevertheless, release criteria must be established with reference to material condition, application process and actual thermal performance. Thermal grease generally consists of base oil and thermally conductive fillers. It is a non‑crosslinking paste and relies on no curing reaction to form a thermal interface. Its storage condition can be affected by temperature cycling, shelf time,…

OBC Housing Leakage during Air Tightness Test? Sealing Troubleshooting with SIPA 1820 CIPG

If the on‑board charger (OBC) housing fails the air tightness test, distinguish leaks at housing joints, connectors and test fixtures first. Once the leak is localised to the flange joint, inspect the continuity of the adhesive bead, consistency of bead height after curing, and insufficient local compression after closure. For the CIPG process where the bead is cured prior to clamping and lid closure, ELAPLUS SIPA 1820 may be evaluated as a candidate for flange sealing. Final acceptance shall rely on repeated air tightness testing of the complete assembly. Leakage Symptom Priority Inspection Verification Method Recurring leaks at bead start/end across multiple units Missing adhesive, excess build‑up or stringing at overlap Compare dispensing trajectory and bead photos; adjust overlap and…

Certification

Mail Contact

+86 18116225322

Welcome to be our distributor

Industrial electronics

Conformal Coating or Potting for Embodied Robot Controller PCBs: Zoned Protection Selection

Thermal Interface between AI Server Chips and Heat Sinks: Selection of Thermal Grease and Gel

Thermal Interface Material for 48V BSG Modules｜TCMP 1941 Thermal Gap Filling Solution

Adhesive for Solder Joint Reinforcement in Camera Modules｜UV 1018 Dispensing and Light‑Shield Zone Validation

Thermal Grease Bleeding after Opening? Re‑Inspection and Material Selection for SIGR 2235

OBC Housing Leakage during Air Tightness Test? Sealing Troubleshooting with SIPA 1820 CIPG

Bonding • Sealing • Thermal conductive

Find the right solution for you?

+86 13291521819

Hot product recommendation

products

EP1716A/B 2K Thermal conductive Epoxy potting material

SIPC 1822 Transparent Silicone Adhesive Sealant

TCMP 1920 liquid thermal conductive gap filler

PUR 1610 A/B Adhesive

SIPA 1850 A/B general use silicone potting compound

SIPC 1859 Silicone Adhesive Sealant

blog

Housing Sealing and PCB Potting Adhesive for Industrial Measuring Instruments? PUR 1680 Polyurethane Protection Solution

Adhesive for Bonding ABS to PVC? ELAPLUS SIPC 2130 Solution for Dissimilar Plastic Bonding

Adhesive for Opaque Ceramic and Metal Sensor Covers? Selection of EPUV 2086 UV Pre-Activated Delay-Cure Epoxy

Why Sensitive MEMS Chips Are Better Protected by Low-Stress Fluorosilicone Gel

ELAPLUS SIPA 1850 High Thermal Conductivity & Anti-Poisoning Silicone Potting Compound – Recommended for LED Power Supplies

How to Choose Adhesive for Housing CIPG Sealing? ELAPLUS SIPA 1820-1K One-Component Silicone Adhesive Solves Housing Sealing Challenges

Contact